H05K 2201/10507
Involving several components
H05K2201/10507 (Involving several components) appears on 2,481 US grants and 2,704 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,481
- Published applications
- 2,704
- Assignees
- 920
- Inventors
- 5,458
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 4 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 9 | 0 |
| 1986 | 8 | 0 |
| 1987 | 8 | 0 |
| 1988 | 8 | 0 |
| 1989 | 11 | 0 |
| 1990 | 14 | 0 |
| 1991 | 20 | 0 |
| 1992 | 11 | 0 |
| 1993 | 5 | 0 |
| 1994 | 18 | 0 |
| 1995 | 14 | 0 |
| 1996 | 16 | 0 |
| 1997 | 13 | 0 |
| 1998 | 24 | 0 |
| 1999 | 26 | 0 |
| 2000 | 32 | 0 |
| 2001 | 33 | 17 |
| 2002 | 50 | 70 |
| 2003 | 56 | 70 |
| 2004 | 59 | 79 |
| 2005 | 58 | 85 |
| 2006 | 65 | 86 |
| 2007 | 52 | 101 |
| 2008 | 58 | 103 |
| 2009 | 49 | 99 |
| 2010 | 86 | 109 |
| 2011 | 62 | 62 |
| 2012 | 74 | 65 |
| 2013 | 58 | 64 |
| 2014 | 66 | 86 |
| 2015 | 68 | 123 |
| 2016 | 87 | 104 |
| 2017 | 109 | 111 |
| 2018 | 115 | 179 |
| 2019 | 177 | 191 |
| 2020 | 198 | 208 |
| 2021 | 169 | 138 |
| 2022 | 127 | 100 |
| 2023 | 101 | 129 |
| 2024 | 89 | 118 |
| 2025 | 100 | 111 |
| 2026 | 62 | 96 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2201/10515Stacked componentsIndexing code864
- H05K 2201/10522Adjacent componentsIndexing code851
- H05K 2201/10545Related components mounted on both sides of the pcbIndexing code659
- H05K 2201/1053Mounted components directly electrically connected to each other, i.e. not via theIndexing code471
- H05K 2201/10537Attached componentsIndexing code99
Recent patents
- Surge suppression device29 Sep 2026US 12,749,890 B2Proterial, Ltd.
- Method and apparatus for surface mount connections8 Sep 2026US 12,731,922 B2Ciena Corporation
- Stretchable substrate, and method for manufacturing stretchable substrate8 Sep 2026US 12,733,091 B2Korea Photonics Technology Institute
- Techniques for adjusting optical paths via angling of optoelectronic components8 Sep 2026US 12,733,105 B2Oura Health Oy
- Electrical control board, air conditioner outdoor unit, and air conditioner11 Aug 2026US 12,704,272 B2Gd Midea Air-Conditioning Equipment Co., Ltd.
- Optical receiver8 Oct 2026US 2026/0312695 A1Nippon Telegraph and Telephone Corporation
- Stepped trace design for impedance compensation of high-speed differential pair channels8 Oct 2026US 2026/0313784 A1Advanced Micro Devices, Inc.
- Systems with vertical power distribution network vias and multiple printed circuit board subassemblies8 Oct 2026US 2026/0313786 A1
- Circuit board and semiconductor package comprising same8 Oct 2026US 2026/0313791 A1LG Innotek Co., Ltd.
- Multilayer back plate with molded ceramic layer8 Oct 2026US 2026/0313849 A1Intel Corporation
Most cited
By later US patents
- Semiconductor integrated circuit device and method of manufacturing the same437US 4,982,265 AAkita Electronics Co., Ltd. · 1991
- Semiconductor device and semiconductor device unit having ball-grid-array type package structure437US 5,726,493 AFujitsu Limited · 1998
- Encapsulated semiconductor device package having holes for electrically conductive material423US 5,608,265 AHitachi, Ltd. · 1997
- Low-cost accelerometer370US 6,336,365 B12002
- Stacked semiconductor device323US 7,049,692 B2Fujitsu Limited · 2006