H05K 2201/10522
Adjacent components
H05K2201/10522 (Adjacent components) appears on 851 US grants and 939 published applications in this corpus.
Search patents in H05K- Granted patents
- 851
- Published applications
- 939
- Assignees
- 437
- Inventors
- 2,105
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 4 | 0 |
| 1991 | 8 | 0 |
| 1992 | 5 | 0 |
| 1993 | 0 | 0 |
| 1994 | 7 | 0 |
| 1995 | 3 | 0 |
| 1996 | 4 | 0 |
| 1997 | 1 | 0 |
| 1998 | 9 | 0 |
| 1999 | 9 | 0 |
| 2000 | 11 | 0 |
| 2001 | 8 | 4 |
| 2002 | 8 | 18 |
| 2003 | 18 | 17 |
| 2004 | 13 | 13 |
| 2005 | 17 | 16 |
| 2006 | 12 | 12 |
| 2007 | 6 | 12 |
| 2008 | 8 | 19 |
| 2009 | 9 | 13 |
| 2010 | 8 | 26 |
| 2011 | 20 | 6 |
| 2012 | 15 | 11 |
| 2013 | 6 | 14 |
| 2014 | 15 | 17 |
| 2015 | 13 | 30 |
| 2016 | 25 | 26 |
| 2017 | 25 | 53 |
| 2018 | 49 | 109 |
| 2019 | 103 | 109 |
| 2020 | 115 | 104 |
| 2021 | 92 | 60 |
| 2022 | 46 | 33 |
| 2023 | 42 | 45 |
| 2024 | 38 | 45 |
| 2025 | 43 | 68 |
| 2026 | 25 | 59 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Surge suppression device29 Sep 2026US 12,749,890 B2Proterial, Ltd.
- Techniques for adjusting optical paths via angling of optoelectronic components8 Sep 2026US 12,733,105 B2Oura Health Oy
- Electrical control board, air conditioner outdoor unit, and air conditioner11 Aug 2026US 12,704,272 B2Gd Midea Air-Conditioning Equipment Co., Ltd.
- Power module28 Jul 2026US 12,695,023 B2Delta Electronics, Inc.
- Printed circuit board and dynamic brake circuit comprising same14 Jul 2026US 12,684,692 B2Fanuc Corporation
- Optical receiver8 Oct 2026US 2026/0312695 A1Nippon Telegraph and Telephone Corporation
- Stepped trace design for impedance compensation of high-speed differential pair channels8 Oct 2026US 2026/0313784 A1Advanced Micro Devices, Inc.
- Circuit board and semiconductor package comprising same8 Oct 2026US 2026/0313791 A1LG Innotek Co., Ltd.
- Fixing structure for electronic module and electronic module1 Oct 2026US 2026/0304595 A1Shindengen Electric Manufacturing Co., Ltd.
- Multiphase power module with paired power stages and embedded inductors1 Oct 2026US 2026/0304628 A1Quanta Computer Inc.
Most cited
By later US patents
- Mirrored pin assignment for two sided multi-chip layout162US 5,502,621 AHewlett-Packard Company · 1996
- Semiconductor package having interlocking heat sinks and method of fabrication106US 6,075,288 AMicron Technology, Inc. · 2000
- Dual-bank memory module with shared capacitors and R-C elements integrated into the module substrate98US 5,841,686 AMA Laboratories, Inc. · 1998
- High voltage, low pass filtering connector with multiple ground planes92US 5,493,259 AThe Whitaker Corporation · 1996
- System and method for edge termination of parallel conductive planes in an electrical interconnecting apparatus84US 6,104,258 ASun Microsystems, Inc. · 2000