H05K 2201/1053
Mounted components directly electrically connected to each other, i.e. not via the
Official title: Mounted components directly electrically connected to each other, i.e. not via the PCB
H05K2201/1053 (Mounted components directly electrically connected to each other, i.e. not via the) appears on 471 US grants and 490 published applications in this corpus.
Search patents in H05K- Granted patents
- 471
- Published applications
- 490
- Assignees
- 226
- Inventors
- 1,128
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 5 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 6 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 3 | 0 |
| 1995 | 8 | 0 |
| 1996 | 6 | 0 |
| 1997 | 4 | 0 |
| 1998 | 5 | 0 |
| 1999 | 6 | 0 |
| 2000 | 5 | 0 |
| 2001 | 4 | 2 |
| 2002 | 9 | 10 |
| 2003 | 7 | 13 |
| 2004 | 8 | 17 |
| 2005 | 16 | 22 |
| 2006 | 12 | 15 |
| 2007 | 12 | 20 |
| 2008 | 9 | 19 |
| 2009 | 10 | 28 |
| 2010 | 21 | 16 |
| 2011 | 8 | 13 |
| 2012 | 11 | 14 |
| 2013 | 12 | 13 |
| 2014 | 16 | 24 |
| 2015 | 15 | 32 |
| 2016 | 16 | 26 |
| 2017 | 28 | 18 |
| 2018 | 25 | 19 |
| 2019 | 20 | 23 |
| 2020 | 26 | 23 |
| 2021 | 22 | 24 |
| 2022 | 25 | 22 |
| 2023 | 18 | 29 |
| 2024 | 16 | 22 |
| 2025 | 22 | 16 |
| 2026 | 13 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed circuit board4 Aug 2026US 12,701,653 B2Samsung Electro-Mechanics Co., Ltd.
- Package structure14 Jul 2026US 12,684,694 B2Industrial Technology Research Institute
- Circuit board having concave ribbon bonds7 Jul 2026US 12,674,554 B1Ford Global Technologies, LLC
- Package bottom side thermal solution with discrete hat-shaped copper spreader component16 Jun 2026US 12,660,077 B2Intel Corporation
- Display device16 Jun 2026US 12,660,088 B2Samsung Display Co., Ltd.
- Optical receiver8 Oct 2026US 2026/0312695 A1Nippon Telegraph and Telephone Corporation
- Display device24 Sep 2026US 2026/0292991 A1Samsung Display Co., Ltd.
- Circuit board assembly and method of manufacturing the same27 Aug 2026US 2026/0255498 A1Avary Holding (Shenzhen) Co., Limited.
- Multicomponent Connector6 Aug 2026US 2026/0231333 A1KYOCERA AVX Components Corporation
- Multilayer Ceramic Capacitor Including Conductive Vias18 Jun 2026US 2026/0171320 A1KYOCERA AVX Components Corporation
Most cited
By later US patents
- Semiconductor device and semiconductor device unit having ball-grid-array type package structure437US 5,726,493 AFujitsu Limited · 1998
- Encapsulated semiconductor device package having holes for electrically conductive material423US 5,608,265 AHitachi, Ltd. · 1997
- Stacked packages151US 6,977,440 B2Tessera, Inc. · 2005
- Interface conditioning insert wafer142US 5,290,191 A1994
- Ball grid array integrated circuit package which employs a flip chip integrated circuit and decoupling capacitors140US 5,798,567 AHewlett-Packard Company · 1998