Package bottom side thermal solution with discrete hat-shaped copper spreader component

An electronic system, comprising:

• a printed circuit board (PCB) with a first surface and a second surface opposite from the first surface, wherein slots extend through a thickness of the PCB;
• a first heat spreader inserted through the slots of the PCB, wherein a bottom portion of the first heat spreader is folded against the second surface of the PCB;
• a second heat spreader inserted through the slots of the PCB, wherein a bottom portion of the heat spreader is folded against the second surface of the PCB, and wherein the second heat spreader and the heat spreader share one of the slots;
• and
• an electronic package coupled to the PCB, wherein the electronic package comprises:
• a die between a package substrate and the PCB, and wherein the die is thermally coupled to the first heat spreader by a thermal interface material (TIM).

A printed circuit board (PCB), comprising:

• a substrate with a first surface and a second surface opposite from the first surface;
• a first slot through a thickness of the substrate;
• a second slot through the thickness of the substrate, wherein the first slot is parallel to the second slot;
• a metal plate, wherein the metal plate comprises:
• a first portion over the first surface of the substrate between the first slot and the second slot;
• a second portion connected to the first portion, wherein the second portion is in the first slot;
• a third portion connected to the first portion, wherein the third portion is in the second slot;
• a fourth portion connected to the second portion, wherein the fourth portion contacts the second surface of the substrate;
• and
• a fifth portion connected to the third portion, wherein the fifth portion contacts the second surface of the substrate;
• and
• a graphite layer on the fourth portion and the fifth portion.

An electronic system, comprising:

• a printed circuit board (PCB) with a first surface and a second surface opposite from the first surface, wherein slots extend through a thickness of the PCB;
• a heat spreader inserted through the slots of the PCB, wherein a bottom portion of the heat spreader is folded against the second surface of the PCB;
• a graphite layer on the bottom portion of the heat spreader;
• and
• an electronic package coupled to the PCB, wherein the electronic package comprises:
• a die between a package substrate and the PCB, and wherein the die is thermally coupled to the heat spreader by a thermal interface material (TIM).