Package structure

A package structure, comprising:

• a circuit board;
• a plurality of circuit structure layers, disposed on the circuit board;
• at least one bridge structure, connected between the two adjacent circuit structure layers of the plurality of the circuit structure layers;
• and
• at least one supporting structure, located between the two adjacent circuit structure layers, and the at least one supporting structure having a first end and a second end opposite to each other and respectively connecting the at least one bridge structure and the circuit board,
• wherein each of the at least one bridge structure comprises a buffer layer, and the buffer layer is a non-conductive elastic material with a Young's modulus ranging from 1 GPa to 100 GPa, and the buffer layer balances connection heights between the two adjacent circuit structure layers and the at least one bridge structure,
• wherein the package structure further comprises:
• a plurality of first solder joints, disposed between each of the two adjacent circuit structure layers and the circuit board, wherein each of the two adjacent circuit structure layers is electrically connected to the circuit board through the first solder joints;
• and
• a plurality of second solder joints, disposed between each of the at least one bridge structure and the two adjacent circuit structure layers, wherein each of the at least one bridge structure is electrically connected to the two adjacent circuit structure layers through the second solder joints,
• wherein each of the at least one bridge structure consists only the buffer layer and directly connects the two adjacent circuit structure layers through the second solder joints.