H05K 2201/10515
Stacked components
H05K2201/10515 (Stacked components) appears on 864 US grants and 929 published applications in this corpus.
Search patents in H05K- Granted patents
- 864
- Published applications
- 929
- Assignees
- 364
- Inventors
- 1,913
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 4 | 0 |
| 1986 | 6 | 0 |
| 1987 | 6 | 0 |
| 1988 | 5 | 0 |
| 1989 | 6 | 0 |
| 1990 | 2 | 0 |
| 1991 | 9 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 7 | 0 |
| 1995 | 9 | 0 |
| 1996 | 8 | 0 |
| 1997 | 7 | 0 |
| 1998 | 12 | 0 |
| 1999 | 10 | 0 |
| 2000 | 12 | 0 |
| 2001 | 14 | 11 |
| 2002 | 19 | 27 |
| 2003 | 26 | 32 |
| 2004 | 30 | 44 |
| 2005 | 24 | 42 |
| 2006 | 31 | 42 |
| 2007 | 26 | 57 |
| 2008 | 22 | 52 |
| 2009 | 25 | 54 |
| 2010 | 44 | 45 |
| 2011 | 26 | 31 |
| 2012 | 37 | 30 |
| 2013 | 26 | 30 |
| 2014 | 29 | 32 |
| 2015 | 25 | 42 |
| 2016 | 43 | 35 |
| 2017 | 35 | 38 |
| 2018 | 40 | 36 |
| 2019 | 34 | 36 |
| 2020 | 35 | 38 |
| 2021 | 34 | 29 |
| 2022 | 26 | 36 |
| 2023 | 33 | 36 |
| 2024 | 29 | 30 |
| 2025 | 22 | 27 |
| 2026 | 13 | 17 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed circuit board and semiconductor package including the same11 Aug 2026US 12,707,569 B2Samsung Electronics Co., Ltd.
- Package structure14 Jul 2026US 12,684,694 B2Industrial Technology Research Institute
- Package device including capacitor disposed on opposite side of die relative to substrate23 Jun 2026US 12,667,023 B2Samsung Electronics Co., Ltd.
- Package bottom side thermal solution with discrete hat-shaped copper spreader component16 Jun 2026US 12,660,077 B2Intel Corporation
- Circuit board, semiconductor device, and method for manufacturing semiconductor device5 May 2026US 12,621,927 B2Kioxia Corporation
- Dummy Body Embedded in a Component Carrier1 Oct 2026US 2026/0304633 A1AT&S (Chongqing) Company Limited
- Wiring board1 Oct 2026US 2026/0304634 A1Shinko Electric Industries Co., Ltd.
- Package for power module3 Sep 2026US 2026/0262167 A1Renesas Electronics America Inc.
- Circuit board, semiconductor device, and method for manufacturing semiconductor device27 Aug 2026US 2026/0255471 A1Kioxia Corporation
- Circuit board assembly and method of manufacturing the same27 Aug 2026US 2026/0255498 A1Avary Holding (Shenzhen) Co., Limited.
Most cited
By later US patents
- Semiconductor integrated circuit device and method of manufacturing the same437US 4,982,265 AAkita Electronics Co., Ltd. · 1991
- Semiconductor device and semiconductor device unit having ball-grid-array type package structure437US 5,726,493 AFujitsu Limited · 1998
- Encapsulated semiconductor device package having holes for electrically conductive material423US 5,608,265 AHitachi, Ltd. · 1997
- Stacked semiconductor device323US 7,049,692 B2Fujitsu Limited · 2006
- Lead connections means for stacked tab packaged IC chips312US 5,138,438 AAkita Electronics Co., Ltd. · 1992