H05K 2201/10537
Attached components
H05K2201/10537 (Attached components) appears on 99 US grants and 103 published applications in this corpus.
Search patents in H05K- Granted patents
- 99
- Published applications
- 103
- Assignees
- 87
- Inventors
- 299
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 4 | 0 |
| 1998 | 3 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 1 |
| 2002 | 3 | 4 |
| 2003 | 2 | 2 |
| 2004 | 5 | 2 |
| 2005 | 0 | 2 |
| 2006 | 2 | 4 |
| 2007 | 0 | 2 |
| 2008 | 3 | 8 |
| 2009 | 2 | 4 |
| 2010 | 4 | 8 |
| 2011 | 0 | 3 |
| 2012 | 3 | 5 |
| 2013 | 2 | 4 |
| 2014 | 4 | 5 |
| 2015 | 6 | 8 |
| 2016 | 3 | 4 |
| 2017 | 7 | 3 |
| 2018 | 2 | 4 |
| 2019 | 6 | 2 |
| 2020 | 2 | 4 |
| 2021 | 5 | 6 |
| 2022 | 2 | 2 |
| 2023 | 2 | 3 |
| 2024 | 3 | 7 |
| 2025 | 3 | 4 |
| 2026 | 4 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Display device28 Jul 2026US 12,696,395 B2Samsung Display Co., Ltd.
- Key module and keyboard14 Jul 2026US 12,683,098 B2Wistron Corporation
- Integrated planar SMA device and method23 Jun 2026US 12,662,994 B2Stardust Redux LLC
- Heat sink component terminations5 May 2026US 12,621,924 B2KYOCERA AVX Components Corporation
- Vehicle-mounted electronic control device30 Sep 2025US 12,432,845 B2Hitachi Astemo, Ltd.
- Heat Sink Component Terminations20 Aug 2026US 2026/0247521 A1KYOCERA AVX Components Corporation
- Vertical integrated voltage regulator with circuit board cutout26 Feb 2026US 2026/0059645 A1Arm Limited
- Circuit arrangement23 Oct 2025US 2025/0331105 A1Continental Autonomous Mobility Germany GmbH
- Sensor Module2 Oct 2025US 2025/0311108 A1Seiko Epson Corporation
- Wiring board and semiconductor device3 Apr 2025US 2025/0113438 A1Shinko Electric Industries Co., Ltd.
Most cited
By later US patents
- Mechanical simultaneous registration of multi-pin surface-mount components to sites on substrates60US 5,034,802 AHewlett-Packard Company · 1991
- Unitized discrete electronic component arrays51US 6,058,004 ADelaware Capital Formation, Inc. · 2000
- Semiconductor integrated circuit devices having particular terminal geometry46US 5,616,962 AKabushiki Kaisha Toshiba · 1997
- Surface mountable coefficient of expansion matching connector43US 4,550,959 AAMP Incorporated · 1985
- Semiconductor device package side-by-side stacking and mounting system41US 5,619,067 ATexas Instruments Incorporated · 1997