Vertical integrated voltage regulator with circuit board cutout

A method of forming an integrated circuit assembly, comprising:

• physically and electrically coupling an integrated circuit die to a first mounting surface of a substrate;
• physically and electrically coupling a vertically integrated voltage regulator assembly to the substrate at a physical location on a second mounting surface of the substrate opposite the first mounting surface of the substrate, wherein at least a portion of the vertically integrated voltage regulator assembly and at least a portion of the integrated circuit die are intersected by an axis normal to and through the first and second mounting surfaces, the vertically integrated voltage regulator assembly comprising one or more inductors and one or more voltage regulation circuits;
• and
• physically and electrically coupling the substrate to a printed circuit board having a hole formed therein, the printed circuit board coupled to the substrate either on the second mounting surface of the substrate such that the vertically integrated voltage regulator assembly is physically located at least partially within the hole formed in the printed circuit board, or on the first mounting surface of the substrate such that the integrated circuit die is physically located at least partially within the hole formed in the printed circuit board.

An assembly, comprising:

• an integrated circuit die;
• a substrate electrically and physically coupled to the integrated circuit die on a first mounting surface of the substrate;
• a printed circuit board having a hole formed therein, the substrate coupled to the printed circuit board on the first mounting surface of the substrate, such that the integrated circuit die is physically located at least partially within the hole formed in the printed circuit board;
• and
• a vertically integrated voltage regulator assembly comprising one or more inductors and one or more voltage regulation circuits, the vertically integrated voltage regulator assembly electrically and physically coupled to the substrate at a physical location on a second mounting surface of the substrate opposite the first mounting surface of the substrate, wherein at least a portion of the vertically integrated voltage regulator assembly and at least a portion of the integrated circuit die are intersected by an axis normal to and through the first and second mounting surfaces.