H05K 2201/10545
Related components mounted on both sides of the pcb
Official title: Related components mounted on both sides of the PCB
H05K2201/10545 (Related components mounted on both sides of the pcb) appears on 659 US grants and 753 published applications in this corpus.
Search patents in H05K- Granted patents
- 659
- Published applications
- 753
- Assignees
- 355
- Inventors
- 1,574
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 0 | 0 |
| 1996 | 5 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 10 | 0 |
| 2000 | 5 | 0 |
| 2001 | 8 | 0 |
| 2002 | 14 | 17 |
| 2003 | 9 | 16 |
| 2004 | 9 | 18 |
| 2005 | 13 | 22 |
| 2006 | 19 | 25 |
| 2007 | 14 | 24 |
| 2008 | 25 | 25 |
| 2009 | 10 | 18 |
| 2010 | 23 | 31 |
| 2011 | 14 | 18 |
| 2012 | 19 | 18 |
| 2013 | 18 | 17 |
| 2014 | 18 | 23 |
| 2015 | 21 | 37 |
| 2016 | 17 | 33 |
| 2017 | 37 | 24 |
| 2018 | 24 | 45 |
| 2019 | 45 | 56 |
| 2020 | 56 | 67 |
| 2021 | 52 | 46 |
| 2022 | 52 | 25 |
| 2023 | 26 | 55 |
| 2024 | 25 | 43 |
| 2025 | 37 | 26 |
| 2026 | 18 | 24 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method and apparatus for surface mount connections8 Sep 2026US 12,731,922 B2Ciena Corporation
- Stretchable substrate, and method for manufacturing stretchable substrate8 Sep 2026US 12,733,091 B2Korea Photonics Technology Institute
- Circuit board module and method for manufacturing same4 Aug 2026US 12,701,659 B2Samsung Electronics Co., Ltd.
- Key module and keyboard14 Jul 2026US 12,683,098 B2Wistron Corporation
- Multilayer back plate with molded ceramic layer23 Jun 2026US 12,666,574 B2Intel Corporation
- Systems with vertical power distribution network vias and multiple printed circuit board subassemblies8 Oct 2026US 2026/0313786 A1
- Multilayer back plate with molded ceramic layer8 Oct 2026US 2026/0313849 A1Intel Corporation
- Multiphase power module with paired power stages and embedded inductors1 Oct 2026US 2026/0304628 A1Quanta Computer Inc.
- Technologies for printed circuit board layout for directly paralleled electronic devices17 Sep 2026US 2026/0282233 A1
- Circuit board assembly with embedded electronic devices and method for manufacturing the same6 Aug 2026US 2026/0231338 A1Avary Holding (Shenzhen) Co., Limited.
Most cited
By later US patents
- Low-cost accelerometer370US 6,336,365 B12002
- Mirrored pin assignment for two sided multi-chip layout162US 5,502,621 AHewlett-Packard Company · 1996
- Redundant power beneath circuit board109US 7,791,889 B2Hewlett-Packard Development Company, L. P. · 2010
- Surface mounted multilayer memory printed circuit board98US 4,891,789 ABull HN Information Systems Inc. · 1990
- Dual-bank memory module with shared capacitors and R-C elements integrated into the module substrate98US 5,841,686 AMA Laboratories, Inc. · 1998