H05K 2201/1059
Connections made by press-fit insertion
H05K2201/1059 (Connections made by press-fit insertion) appears on 504 US grants and 441 published applications in this corpus.
Search patents in H05K- Granted patents
- 504
- Published applications
- 441
- Assignees
- 315
- Inventors
- 1,218
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 3 | 0 |
| 1978 | 6 | 0 |
| 1979 | 1 | 0 |
| 1980 | 7 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 6 | 0 |
| 1987 | 5 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 12 | 0 |
| 1991 | 12 | 0 |
| 1992 | 15 | 0 |
| 1993 | 7 | 0 |
| 1994 | 4 | 0 |
| 1995 | 7 | 0 |
| 1996 | 8 | 0 |
| 1997 | 14 | 0 |
| 1998 | 14 | 0 |
| 1999 | 11 | 0 |
| 2000 | 6 | 0 |
| 2001 | 9 | 2 |
| 2002 | 7 | 3 |
| 2003 | 5 | 13 |
| 2004 | 11 | 12 |
| 2005 | 3 | 12 |
| 2006 | 13 | 19 |
| 2007 | 11 | 20 |
| 2008 | 10 | 33 |
| 2009 | 17 | 38 |
| 2010 | 19 | 29 |
| 2011 | 23 | 17 |
| 2012 | 20 | 18 |
| 2013 | 13 | 20 |
| 2014 | 13 | 12 |
| 2015 | 15 | 13 |
| 2016 | 8 | 12 |
| 2017 | 13 | 9 |
| 2018 | 12 | 18 |
| 2019 | 17 | 28 |
| 2020 | 25 | 19 |
| 2021 | 18 | 22 |
| 2022 | 15 | 18 |
| 2023 | 16 | 22 |
| 2024 | 15 | 16 |
| 2025 | 14 | 9 |
| 2026 | 6 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Connector18 Aug 2026US 12,713,515 B2Suzhou Metabrain Intelligent Technology Co., Ltd.
- Press-in machine for pressing components into a substrate, in particular into a printed circuit board or carrier plate, with substrate positioning11 Aug 2026US 12,707,617 B2ERSA GmbH
- Board-level architecture and communications device12 May 2026US 12,627,087 B2Huawei Technologies Co., Ltd.
- Electrical feed connector system and method for light emitting diode (LED) circuit boards with varied placement of wire terminal connection points17 Mar 2026US 12,580,330 B2
- Circuit system and method of manufacturing a printed circuit board17 Mar 2026US 12,581,591 B2NVIDIA Corporation
- Circuit board for receiving at least one contact pin, method for contacting a circuit board and circuit21 May 2026US 2026/0143590 A1Bizlink Industry Germany GmbH
- Circuit board coupling structure21 May 2026US 2026/0143612 A1LG Energy Solution, Ltd.
- Transfer molded power modules and methods of manufacture12 Mar 2026US 2026/0074448 A1Semiconductor Components Industries, LLC
- Electronical connector and press-fit terminal thereof19 Feb 2026US 2026/0051683 A1SDI Corporation
- Semiconductor module and a method for coupling a semiconductor module with a printed circuit board12 Feb 2026US 2026/0045714 A1
Most cited
By later US patents
- Methods of assembling microelectronic assembly with socket for engaging bump leads327US 5,802,699 ATessera, Inc. · 1998
- Soldering with resilient contacts217US 5,980,270 ATessera, Inc. · 1999
- Conductive elastomeric contacts and connectors186US 3,971,610 ATechnical Wire Products, Inc. · 1976
- Soldering with resilient contacts176US 5,615,824 ATessera, Inc. · 1997
- Microelectronic contacts with asperities and methods of making same175US 5,632,631 ATessera, Inc. · 1997