H05K 2201/1056
Metal over component, i.e. metal plate over component mounted on or embedded
Official title: Metal over component, i.e. metal plate over component mounted on or embedded in PCB
H05K2201/1056 (Metal over component, i.e. metal plate over component mounted on or embedded) appears on 195 US grants and 242 published applications in this corpus.
Search patents in H05K- Granted patents
- 195
- Published applications
- 242
- Assignees
- 118
- Inventors
- 407
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 3 | 1 |
| 2003 | 2 | 4 |
| 2004 | 3 | 5 |
| 2005 | 1 | 7 |
| 2006 | 12 | 36 |
| 2007 | 8 | 25 |
| 2008 | 20 | 20 |
| 2009 | 15 | 17 |
| 2010 | 12 | 7 |
| 2011 | 10 | 7 |
| 2012 | 4 | 4 |
| 2013 | 6 | 9 |
| 2014 | 3 | 9 |
| 2015 | 6 | 17 |
| 2016 | 15 | 15 |
| 2017 | 16 | 6 |
| 2018 | 9 | 13 |
| 2019 | 11 | 6 |
| 2020 | 4 | 6 |
| 2021 | 8 | 8 |
| 2022 | 5 | 7 |
| 2023 | 5 | 3 |
| 2024 | 4 | 3 |
| 2025 | 1 | 5 |
| 2026 | 4 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Thermal transfer, management and integrated control structure21 Jul 2026US 12,690,457 B23D Glass Solutions, Inc.
- Package bottom side thermal solution with discrete hat-shaped copper spreader component16 Jun 2026US 12,660,077 B2Intel Corporation
- Vacuum-based attachment for heat sink and radiation shield9 Jun 2026US 12,652,786 B2Intel Corporation
- Solid state power switch assembly of an aircraft solid state power controller and method of providing a solid state power switch assembly for an aircraft solid state power controller2 Jun 2026US 12,646,907 B2Hs Elektronik Systeme GmbH
- Circuit module9 Sep 2025US 12,414,225 B2Murata Manufacturing Co., Ltd.
- Connector substrate assembly capable of covering ac capacitor, and female connector thereof11 Jun 2026US 2026/0164560 A1Amphenol East Asia Limited Taiwan Branch (H.K.)
- Printed circuit board assembly26 Feb 2026US 2026/0059647 A1Rolls-Royce Deutschland Ltd & Co KG
- Electromagnetic shielding cap for electronic circuits4 Dec 2025US 2025/0374710 A1STMicroelectronics International N. V.
- High-density power delivery system with orthogonal power flow2 Oct 2025US 2025/0309760 A1Empower Semiconductor, Inc.
- Compact power electronics device for controlling electric vehicle batteries6 Mar 2025US 2025/0074225 A1Volvo Car Corporation
Most cited
By later US patents
- L.E.D. thermal management341US 6,428,189 B1Relume Corporation · 2002
- High density memory module using stacked printed circuit boards177US 7,254,036 B2Netlist, Inc. · 2007
- Semiconductor module with imbedded heat spreader126US 6,449,159 B1Rambus Inc. · 2002
- Semiconductor module with serial bus connection to multiple dies118US 6,833,984 B1Rambus Inc. · 2004
- Power converter assembly109US 6,549,409 B1VLT, Inc. · 2003