High density memory module using stacked printed circuit boards

A module connectable to a computer system, the module comprising:

• a frame comprising an edge connector connectable to the computer system;
• a first printed circuit board coupled to the frame, the first printed circuit board having a first surface and a first plurality of components mounted on the first surface, the first plurality of components electrically coupled to the edge connector;
• a second printed circuit board coupled to the frame, the second printed circuit board having a second surface and a second plurality of components mounted on the second surface, the second plurality of components electrically coupled to the edge connector, the second surface facing the first surface;
• and
• a heat spreader comprising at least one sheet of thermally conductive material, the heat spreader positioned between and thermally coupled to the first plurality of components and the second plurality of components, the heat spreader thermally coupled to the edge connector.

A method of conducting heat away from a first plurality of components mounted on a first surface of a first printed circuit board and from a second plurality of components mounted on a second surface of a second printed circuit board, the method comprising:

• coupling the first printed circuit board and the second printed circuit board to a frame comprising an edge connector, the first surface facing the second surface;
• positioning a thermally conductive layer between the first plurality of components and the second plurality of components;
• thermally coupling the thermally conductive layer to the first plurality of components, to the second plurality of components, and to the edge connector;
• and
• electrically and thermally coupling the edge connector to a computer system, thereby providing a thermal pathway for heat to be removed from the first plurality of components and from the second plurality of components to the computer system through the edge connector.

A method of fabricating a module electrically connectable to a computer system, the method comprising:

• providing a frame comprising an edge connector electrically connectable to the computer system, the frame further comprising at least one layer of thermally conductive material which is thermally coupled to the edge connector;
• mounting a first printed circuit board to the frame, the first printed circuit board having a first surface and a first plurality of components mounted on the first surface, the first plurality of components electrically coupled to the edge connector and thermally coupled to the at least one layer of thermally conductive material;
• and
• mounting a second printed circuit board to the frame, the second printed circuit board having a second surface and a second plurality of components mounted on the second surface, the second plurality of components electrically coupled to the edge connector and thermally coupled to the at least one layer of thermally conductive material.