Circuit module

A circuit module comprising:

• an upper circuit board;
• a lower circuit board;
• a first component;
• a first sealing resin;
• a heat conduction member;
• a first conductor layer;
• and
• a heat dissipation member,
• wherein
• the upper circuit board includes an upper circuit board body and one or more upper circuit board first mounting electrodes,
• the lower circuit board includes a lower circuit board body and one or more lower circuit board first mounting electrodes, and is disposed below the upper circuit board,
• the upper circuit board body has a first upper main surface and a first lower main surface,
• the lower circuit board body has a second upper main surface and a second lower main surface,
• the first sealing resin is disposed between the first lower main surface and the second upper main surface,
• the one or more upper circuit board first mounting electrodes are disposed on the first lower main surface,
• the one or more lower circuit board first mounting electrodes are disposed on the second upper main surface,
• the first component is mounted on the one or more upper circuit board first mounting electrodes or the one or more lower circuit board first mounting electrodes, and is disposed in the first sealing resin,
• the first conductor layer is disposed on the upper circuit board or the lower circuit board,
• the heat conduction member overlaps the first component as viewed in a downward direction of an up-down axis, is disposed on the first lower main surface, on the second upper main surface, or in a space between the first lower main surface and the second upper main surface, and is directly coupled to the first conductor layer or is coupled to the first conductor layer via a first conductor,
• a part of the heat dissipation member is exposed from the first sealing resin in a direction orthogonal to the up-down axis, and
• the heat dissipation member is directly coupled to the first conductor layer or is coupled to the first conductor layer via a second conductor.