H05K 2201/10583
Cylindrically shaped component
Official title: Cylindrically shaped component; Fixing means therefore
H05K2201/10583 (Cylindrically shaped component) appears on 98 US grants and 77 published applications in this corpus.
Search patents in H05K- Granted patents
- 98
- Published applications
- 77
- Assignees
- 95
- Inventors
- 235
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 4 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 3 |
| 2003 | 2 | 1 |
| 2004 | 1 | 2 |
| 2005 | 1 | 2 |
| 2006 | 2 | 1 |
| 2007 | 1 | 4 |
| 2008 | 0 | 5 |
| 2009 | 3 | 3 |
| 2010 | 6 | 0 |
| 2011 | 3 | 1 |
| 2012 | 0 | 4 |
| 2013 | 1 | 3 |
| 2014 | 3 | 4 |
| 2015 | 3 | 2 |
| 2016 | 1 | 8 |
| 2017 | 5 | 4 |
| 2018 | 3 | 4 |
| 2019 | 5 | 5 |
| 2020 | 4 | 4 |
| 2021 | 1 | 3 |
| 2022 | 2 | 0 |
| 2023 | 0 | 5 |
| 2024 | 4 | 6 |
| 2025 | 3 | 2 |
| 2026 | 3 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wire structure, wire capacitor, and electronic device including the wire capacitor16 Jun 2026US 12,658,341 B2Samsung Electronics Co., Ltd.
- Semiconductor storage device28 Apr 2026US 12,615,717 B2Kioxia Corporation
- Semiconductor device package with coupled substrates20 Jan 2026US 12,532,777 B2SanDisk Technologies LLC
- Electronic device comprising surface-mount device type dipoles, and corresponding assembly method11 Nov 2025US 12,471,219 B2STMicroelectronics (Grenoble 2) SAS
- Semiconductor storage device8 Jul 2025US 12,356,551 B2Kioxia Corporation
- Semiconductor storage device6 Aug 2026US 2026/0231336 A1Kioxia Corporation
- Electronic unit4 Dec 2025US 2025/0374435 A1Nissan Motor Co., Ltd.
- Mechanical snap locking7 Aug 2025US 2025/0254797 A1Honeywell International Inc.
- Laterally placed capacitor package assembly and assembly method thereof26 Dec 2024US 2024/0431032 A1Apaq Technology Co., Ltd.
- Surface mount electrical devices and methods12 Dec 2024US 2024/0412937 A1Bourns, Inc.
Most cited
By later US patents
- Vehicle lamp411US 5,038,255 AFurukawa Electric Co., Ltd. · 1991
- Ultra-small LED electrode assembly and method for manufacturing same114US 9,773,761 B2Psi Co., Ltd. · 2017
- Insertion of electrical component within a via of a printed circuit board41US 6,983,535 B2International Business Machines Corporation · 2006
- Monolithic inductor40US 6,087,920 APulse Engineering, Inc. · 2000
- Solderless circuit board component39US 4,109,295 ANCR Corporation · 1978