Insertion of electrical component within a via of a printed circuit board
AssigneeInternational Business Machines Corporation
InventorsTimothy Wayne Crockett, Harry Thomas Minikel
Life of this patent
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Abstract
A method for reducing the impedance of a reference path in a printed circuit board includes forming a printed circuit board having a plurality of conductive layers including first, second, third, and fourth layers. The printed circuit board includes two or more vias interconnecting two or more of the conductive layers. A first via is part of a signal path configured to carry a signal from the first layer to the second layer. A second via is part of a reference path configured to carry said signal from a third layer to a fourth conductive layer. The method further includes embedding an electrical component, such as a capacitor, in the second via between two of the conductive layers.
Claims7
A method for reducing impedance within a reference path in a printed circuit board comprising the steps of:
- forming said printed circuit board comprising a plurality of conductive layers, wherein one of said plurality of conductive layers is a first layer, wherein one of said plurality of conductive layers is a second layer, wherein said printed circuit board further comprises two or more vias interconnecting two or more conductive layers of said plurality of conductive layers, wherein a first of said two or more vias is part of a signal path configured to carry said signal from said first layer to said second layer, wherein a second of said two or more vias is part of a reference path configured to carry said signal from a third layer to a fourth conductive layer;
- and
- embedding an electrical component in said second of said two or more vias between two conductive layers of said plurality of conductive layers;
- wherein said electrical component has a greater diameter in a center than at ends of said electrical component, wherein each end of said electrical component has a conductive cap which is tinned.
Dependencies are inferred from the claim text.