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US 12,658,341 B2Granted
Wire structure, wire capacitor, and electronic device including the wire capacitor
AssigneeSamsung Electronics Co., Ltd.
InventorsJaehoon Kim, Hyun-Ji Song
Life of this patent
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Abstract
A wire structure includes a metal layer, a dielectric layer covering at least a portion of an outer surface of the metal layer, and a filling material provided in the dielectric layer, wherein a flexibility of the filling material is higher than a flexibility of the dielectric layer.
Claims20
A wire structure comprising:
- a metal layer;
- a dielectric layer covering at least a portion of an outer surface of the metal layer, the dielectric layer being hollow and cylindrical;
- and
- a filling material provided in the dielectric layer and filling cracks generated by applying an external force to the dielectric layer,
- wherein a flexibility of the filling material is higher than a flexibility of the dielectric layer.
2 more elements
A wire capacitor comprising:
- a first metal layer;
- a dielectric layer covering at least a portion of an outer surface of the first metal layer, the dielectric layer being hollow and cylindrical;
- a second metal layer covering at least a portion of an outer surface of the dielectric layer;
- and
- a filling material provided in the dielectric layer and filling cracks generated by applying an external force to the dielectric layer,
- wherein a flexibility of the filling material is higher than a flexibility of the dielectric layer.
3 more elements
An electronic device comprising:
- a substrate comprising:
- a base insulating layer;
- a plurality of line patterns provided in the base insulating layer;
- and
- a plurality of vias provided in the base insulating layer and contacting and electrically connected to at least some line patterns of the plurality of line patterns;
- and
- a wire capacitor contacting at least some line patterns of the plurality of line patterns and configured to store charges,
- wherein the wire capacitor comprises:
- a first metal layer;
- a dielectric layer covering at least a portion of an outer surface of the first metal layer, the dielectric layer being hollow and cylindrical;
- a second metal layer covering at least a portion of an outer surface of the dielectric layer;
- and
- a filling material provided in the dielectric layer and filling cracks generated by applying an external force to the dielectric layer,
- wherein a flexibility of the filling material is higher than a flexibility of the dielectric layer.
11 more elements
Dependencies are inferred from the claim text.