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US 12,532,777 B2Granted
Semiconductor device package with coupled substrates
AssigneeSanDisk Technologies LLC
InventorsRohith Kamath, Amit Vijayvargiya, Shankara Venkatraman Gopalan, Shankar AB
Life of this patent
Estimating the term…
Abstract
A semiconductor device package includes a first substrate extending along a first central plane, and a second substrate electrically connected to the first substrate and extending along a second central plane that is substantially parallel with and offset from the first central plane of the first substrate. One or more capacitors are electrically and mechanically connected to the second substrate via one or more leads. All of the one or more capacitors are positioned at the second substrate. All of the capacitors being positioned at the second substrate, reduces the complexity of and time required to manufacture the semiconductor device package.
Claims20
A semiconductor device package comprising:
- a first substrate having a top planar surface and a bottom planar surface substantially parallel to the top planar surface, the first substrate extending along a first central plane substantially parallel with the top and bottom planar surfaces and equidistant between the top and bottom planar surfaces;
- a second substrate electrically connected to the first substrate, the second substrate having a top planar surface and a bottom planar surface substantially parallel to the top planar surface, the second substrate extending along a second central plane substantially parallel with the top and bottom planar surfaces of the second substrate and equidistant between the top and bottom planar surfaces, the second central plane being substantially parallel with and offset from the first central plane of the first substrate;
- and
- one or more capacitors electrically and mechanically connected to the second substrate via one or more leads,
- wherein all of the one or more capacitors are positioned at the second substrate,
- wherein each of the one or more capacitors extends circumferentially around a respective capacitor central axis, and
- wherein each capacitor central axis of each of the one or more capacitors is positioned between the first central plane of the first substrate and the second central plane of the second substrate.
4 more elements
A semiconductor device package comprising:
- one or more capacitors;
- a controller and one or more NAND dies;
- and
- a first PCB extending along a first central plane that is substantially parallel to and equidistant from a top surface and bottom surface of the first PCB and a second PCB extending along a second central plane that is substantially parallel to and equidistant from a top surface and bottom surface of the second PCB, the second PCB electrically connected to and offset from the first PCB, the second PCB being substantially parallel to the first PCB and extending outwardly therefrom,
- wherein the controller and the one or more NAND dies are directly coupled to the first PCB,
- wherein each of the one or more capacitors is directly coupled to the second PCB,
- wherein each of the one or more capacitors extends circumferentially around a respective capacitor central axis, and
- wherein each capacitor central axis of each of the one or more capacitors is positioned between the first central plane of the first PCB and the second central plane of the second PCB.
5 more elements
A semiconductor device package comprising:
- a first substrate means for providing electrical communication to one or more electrical components coupled to the first substrate means, the first substrate means extending along a first central plane that is substantially parallel with a top planar surface and a bottom planar surface of the first substrate means and the first central plane is equidistant between the top and bottom planar surfaces of the first substrate means;
- a second substrate means for providing electrical communication to one or more electrical components coupled to the second substrate means, the second substrate means electrically and mechanically coupled to the first substrate means, the second substrate means extending along a second central plane that is substantially parallel with a top planar surface and a bottom planar surface of the second substrate means and the second central plane is equidistant between the top and bottom planar surfaces of the second substrate means;
- and
- one or more electrical storage means each for storing an amount of electrical charge, each of the one or more electrical storage means being electrically connected to the second substrate means by a respective electrical connection means,
- wherein the first and second substrate means are substantially parallel to one another and offset from one another,
- wherein all of the one or more electrical storage means are positioned at the second substrate,
- wherein each of the one or more electrical storage means extend circumferentially around a respective central axis, and
- wherein each central axis of each of the one or more electrical storage means is positioned between the first central plane of the first substrate means and the second central plane of the second substrate means.
5 more elements
Dependencies are inferred from the claim text.