Laterally placed capacitor package assembly and assembly method thereof

A laterally placed capacitor package assembly, comprising:

• a wound capacitor package structure including a wound assembly, a conductive assembly and a package assembly, wherein the conductive assembly includes a first conductive pin electrically contacting the wound assembly and a second conductive pin electrically contacting the wound assembly, and the wound assembly is disposed inside the package assembly;
• and
• a capacitor supporting structure including a supporting portion configured to support the wound capacitor package structure and a plurality of positioning portions extending outward from the supporting portion;
• wherein the first conductive pin includes a first embedded portion accommodated inside the package assembly and a first exposed portion exposed outside the package assembly, and the second conductive pin includes a second embedded portion accommodated inside the package assembly and a second exposed portion exposed outside the package assembly;
• wherein the first exposed portion of the first conductive pin and the second exposed portion of the second conductive pin laterally extend from the package assembly without bending.

An assembly method of a laterally placed capacitor package assembly, comprising:

• providing a wound capacitor package structure and a capacitor supporting structure on a circuit substrate, wherein the capacitor supporting structure has a supporting portion passing through the circuit substrate and a plurality of positioning portions disposed on the circuit substrate;
• and
• electrically connecting the wound capacitor package structure to the circuit substrate;
• wherein the wound capacitor package structure includes a wound assembly, a conductive assembly and a package assembly, the conductive assembly includes a first conductive pin electrically contacting the wound assembly and a second conductive pin electrically contacting the wound assembly, and the wound assembly is disposed inside the package assembly;
• wherein the supporting portion of the capacitor supporting structure is configured to support the wound capacitor package structure, and the plurality of positioning portions of the capacitor supporting structure are configured to extend outward from the supporting portion;
• wherein the first exposed portion of the first conductive pin and the second exposed portion of the second conductive pin laterally extend from the package assembly without bending and are electrically connected to the circuit substrate.