H05K 2201/10575
Insulating foil under component
H05K2201/10575 (Insulating foil under component) appears on 29 US grants and 28 published applications in this corpus.
Search patents in H05K- Granted patents
- 29
- Published applications
- 28
- Assignees
- 31
- Inventors
- 88
- Latest grant
- 19 May 2020
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 2 |
| 2004 | 1 | 1 |
| 2005 | 1 | 3 |
| 2006 | 1 | 0 |
| 2007 | 1 | 2 |
| 2008 | 1 | 5 |
| 2009 | 0 | 3 |
| 2010 | 2 | 0 |
| 2011 | 3 | 2 |
| 2012 | 1 | 1 |
| 2013 | 1 | 1 |
| 2014 | 1 | 0 |
| 2015 | 1 | 1 |
| 2016 | 1 | 1 |
| 2017 | 1 | 0 |
| 2018 | 0 | 3 |
| 2019 | 2 | 1 |
| 2020 | 1 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 1 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Electronic component with two substrates enclosing functional element and insulating film therein19 May 2020US 10,659,003 B2Taiyo Yuden Co., Ltd.
- Coating for limiting substrate damage due to discrete failure26 Nov 2019US 10,492,289 B2International Business Machines Corporation
- Coating for limiting substrate damage due to discrete failure5 Nov 2019US 10,470,290 B2International Business Machines Corporation
- Circuit board configurations facilitating operation of heat sensitive sensor components30 May 2017US 9,664,569 B2Google Inc.
- LED module and lighting assembly24 May 2016US 9,349,930 B2
- Coverlay as printed circuit board (pcb) voltage insulator under connectors10 Jul 2025US 2025/0227854 A1Hamilton Sundstrand Corporation
- Electronic component and method for manufacturing the same16 Jun 2022US 2022/0190805 A1KYOCERA Corporation
- Multi-layer interconnected electro-thermal system having a thermally non-expansive support for mounting positionally related sensor components19 Dec 2019US 2019/0387615 A1Microsoft Technology Licensing, LLC
- Coating for Limiting Substrate Damage Due to Discrete Failure8 Nov 2018US 2018/0324944 A1International Business Machines Corporation
- Coating for Limiting Substrate Damage Due to Discrete Failure8 Nov 2018US 2018/0324946 A1International Business Machines Corporation
Most cited
By later US patents
- Low cost, large scale RF hybrid package for simple assembly onto mixed signal printed wiring boards20US 6,417,747 B1Raytheon Company · 2002
- Method for forming a microelectronic assembly19US 5,848,466 AMotorola, Inc. · 1998
- Removable VLSI assembly16US 5,164,818 AInternational Business Machines Corporation · 1992
- Circuit board configurations facilitating operation of heat sensitive sensor components16US 9,664,569 B2Google Inc. · 2017
- Molded circuit board14US 4,914,259 AFurukawa Electric Co., Ltd. · 1990