Multi-layer interconnected electro-thermal system having a thermally non-expansive support for mounting positionally related sensor components

An apparatus comprising:

• a circuit board layer having a first coefficient of thermal expansion (CTE);
• a sensor support layer having a second CTE that is less than the first CTE of the circuit board layer;
• a first sensor component that is mechanically coupled to the sensor support layer;
• a second sensor component that is positionally related to the first sensor component and this is mechanically coupled to the sensor support layer at a nominal positional relationship from the first sensor component, wherein the nominal positional relationship includes at least a nominal distance and a nominal angle;
• and
• an adhesive layer having an intermediate CTE that is less than the first CTE and greater than the second CTE, wherein the adhesive layer is between the circuit board layer and the sensor support layer to indirectly couple the first sensor component and the second sensor component to the circuit board layer in accordance with the nominal positional relationship.

A system, comprising:

• a first sensor component and a second sensor component that is positionally related to the first sensor component;
• a sensor support layer for supporting the first sensor component and the second sensor component;
• a vapor chamber having a first side and a second side that is mechanically coupled to the sensor support layer;
• a circuit board layer that is mechanically coupled to the first side of the vapor chamber;
• and
• at least one electronic component that is electrically coupled to one or more conductive traces of the circuit board layer.