Electronic component and method for manufacturing the same

An electronic component manufacturing method comprising:

• a disposition step of disposing an electronic element on a supporting body so as to bring a first surface of the electronic element into close contact with the supporting body;
• a forming step of supplying an insulating material around the electronic element on the supporting body and hardening the insulating material to form a surrounding member;
• a removal step of removing the supporting body from the first surface and from a second surface of the surrounding member from which the first surface is exposed;
• and
• a joining step of disposing an insulating material that makes up a joining member between a third surface constituted by the first surface and the second surface and a wiring board to join the third surface and the wiring board together, and disposing a conductive bump between the third surface and the wiring board to electrically connect the electronic element and the wiring board to each other, wherein
• in the joining step,
• in the material that makes up the joining member, a through hole that passes through the material making up the joining member from the third surface to the wiring board and accommodates the bump is made, and
• at least a portion of the through hole overlaps the second surface in perspective plan view.