Low cost, large scale RF hybrid package for simple assembly onto mixed signal printed wiring boards

An RF electrical assembly, comprising:

• an RF package comprising:
• an external housing including a wall structure having an interconnect opening formed therein;
• an electrically conductive feed-through pin structure mounted in the interconnect opening, the pin structure including an elongated electrically conductive pin supported on a dielectric spacer element in the interconnect opening, the pin having an interior end disposed within the housing for connection to RF circuitry, and a distal end for interconnection with an interconnection structure external to the RF package;
• a plurality of electrically conductive shield pins connected to the wall structure and extending outwardly from the housing and disposed to surround an external portion of the center pin to form a coaxial shield structure;
• and
• a multi-layer printed wiring board (PWB) electrically connected to the RF package through said pin and coaxial shield structure, the PWB including:
• a center pin hole formed through a first surface to a first predetermined depth to a layer having an RF conductive trace defined thereon;
• a plurality of shield pin holes formed through said first surface to a second predetermined depth to respective conductive pads connected to a ground plane;
• a center pin compressible wire interconnect structure disposed in said center pin hole to make electrical contact with a distal tip of the center pin when the package is assembled to the PWB;
• a plurality of shield pin compressible wire bundle interconnect structures disposed in said shield pin holes to make electrical contact with respective distal tips of the shield pins when the package is assembled to the PWB.