Circuit board configurations facilitating operation of heat sensitive sensor components

A multilayered circuit board, comprising:

• a first conductive layer lying generally parallel to a horizontal plane;
• a metal-free region extending along a vertical axis through at least a portion of the first conductive layer;
• and
• a first outer surface being located along the vertical axis above the first conductive layer, lying generally parallel to the horizontal plane, and supporting a heat-emitting component and a heat-sensitive component, the heat-emitting component and the metal-free region being spaced along the vertical axis and the horizontal plane, the heat-sensitive component and the metal-free region being spaced along the vertical axis and generally aligned along the horizontal plane,
• wherein the metal-free region thermally isolates the heat-sensitive component by resisting heat flowing generally parallel to the horizontal plane towards the heat-sensitive component.

A multilayered circuit board, comprising:

• first conducting means being located along a vertical axis;
• a metal-free region extending along a vertical axis through at least a portion of the first conducting means;
• and
• a first surface being located along the vertical axis above the first conducting means and supporting a heat-emitting means and a heat-sensitive component, the heat-emitting means and the metal-free region being vertically and laterally spaced apart, the heat-sensitive component and the metal-free region being vertically spaced apart and laterally aligned,
• wherein the metal-free region thermally isolates the heat-sensitive component by resisting radial heat flow towards the heat-sensitive component.