LED module and lighting assembly
OwnerChung Hoon Leeinventor
Life of this patent
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Abstract
Disclosed are a light emitting diode (LED) module and a lighting assembly. The lighting assembly comprises a light emitting device, a driver integrated circuit device for driving the light emitting device, a heat sink for dissipating heat generated from the light emitting device, and a heat shielding portion for blocking thermal interference between the driver integrated circuit device and the light emitting device. In the LED module, the driver integrated circuit device is disposed on the heat shielding portion. Accordingly, it is possible to block thermal interference between the light emitting device and the driver integrated circuit device and to decrease the size of the lighting assembly.
Claims18
A light emitting diode (LED) lighting assembly, comprising:
- a heat sink;
- a printed circuit board (PCB) comprising a wire pattern, wherein the PCB is disposed on the heat sink;
- a light emitting device disposed on the heat sink and mounted on the PCB;
- a driver integrated circuit device disposed on the heat sink;
- and
- a heat shielding portion disposed between the PCB and the driver integrated circuit device,
- wherein the driver integrated circuit device is a chip level driver integrated circuit device that comprises a bond wire that connects the driver integrated circuit device to the wire pattern of the PCB, and
- wherein the heat shielding portion is configured to block thermal interference between the driver integrated circuit device and the light emitting device.
An LED module, comprising:
- a heat sink;
- a printed circuit board (PCB) comprising a wire pattern, wherein the PCB is disposed on the heat sink;
- a light emitting device disposed on the heat sink and mounted on the PCB;
- a driver integrated circuit device disposed on the heat sink;
- and
- a heat shielding portion disposed between the PCB and the driver integrated circuit device,
- wherein the driver integrated circuit device is a chip level driver integrated circuit device that comprises a bond wire that connects the driver integrated circuit device to the wire pattern of the PCB.
A light emitting diode (LED) lighting assembly, comprising:
- a heat sink;
- a printed circuit board (PCB) comprising a wire pattern, wherein the PCB is disposed on the heat sink;
- a light emitting device disposed on the heat sink and mounted on the PCB;
- a driver integrated circuit device disposed on the heat sink;
- and
- a heat shielding portion comprising a metal pad and a bond wire, wherein the heat shielding portion is disposed between the PCB and the driver integrated circuit device,
- wherein the driver integrated circuit device is a package level driver integrated circuit device that comprises a lead that connects to the metal pad of the heat shield portion,
- wherein the metal pad connects to the wire pattern through the bond wire, and
- wherein the heat shielding portion is configured to block thermal interference between the driver integrated circuit device and the light emitting device.
Dependencies are inferred from the claim text.