Removable VLSI assembly
AssigneeInternational Business Machines Corporation
InventorsArnold Blum, Frank Gerth, Manfred Perske, Manfred Schmidt
Life of this patent
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Abstract
A system for mounting VLSI devices on a substrate is disclosed, offering a high contact density. Each package consists of a semiconductor device having protruding elongated contact pin (2) on its surface and a wiring substrate having a cavity (3) on its surface. The cavities are filed with a conductive material (7) of a low melting point composition and sealed with a thin non-conductive foil (4). During packaging, the contact pins are made to penetrate the foil, and extend into the conductive alloy, thus making electrical contact therewith. To ease the penetration of the foil, the contact pins could be set into oscillating motion by means of an ultrasonic generator.
Claims12
A semiconductor package comprising a semiconductor device having a major surface;
- a plurality of elongated means located on the surface of said device extending perpendicular to said major surface, and
- a substrate having a major surface and a a plurality of cavities on the major surface of said substrate, each cavity of said plurality of cavities, located with respect to the corresponding position of one of said plurality of elongated means on said device,
- a conductive metal having a melting temperature no greater than wood alloy melting temperatures in each of said cavities;
- and
- a nonconductive foil covering each of said cavities and said conductive metal,
- said elongated means penetrating said foil and establishing electrical contact between said conductive metal and said elongated means.
Dependencies are inferred from the claim text.