Coating for limiting substrate damage due to discrete failure
AssigneeInternational Business Machines Corporation
InventorsBruce J. Chamberlin, Scott B. King, Joseph Kuczynski, David J. Russell
Life of this patent
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Abstract
A component having a coating comprising a material in a first phase (e.g., solid and/or liquid phase) with a transition temperature. The component is mechanically and/or electrically attached to a substrate. Exposure of the coating to a temperature that meets or exceeds the transition temperature causes the material to undergo a phase change. The phase change of the material alters the position of the component, including separation of the component from the substrate. The separation disrupts the attachment, thereby mitigating damage to the substrate and/or component.
Claims20
A method comprising:
- configuring a component in communication with a substrate in a first position;
- applying a coating to the component, the coating comprising a material in a first phase having a transition temperature;
- subjecting the coating to a thermal event meeting or exceeding the transition temperature, wherein the transition temperature of the material is about 270 degrees Celsius;
- responsive to the thermal event, subjecting the material to a phase change from the first phase to a second phase;
- and
- the phase change altering the positon of the component from the first position to a second position, including the second position being a separation of the component from the substrate.
A method comprising:
- configuring a component in communication with a substrate in a first position;
- applying a coating to the component, the coating comprising a material in a first phase having a transition temperature;
- subjecting the coating to a thermal event meeting or exceeding the transition temperature, wherein the transition temperature of the material is about 270 degrees Celsius;
- responsive to the thermal event, subjecting the material to a phase change from the first phase to a second phase;
- and
- the phase change altering the positon of the component from the first position to a second position, including the second position being a separation of the component from the substrate wherein the separation of the component from the substrate is isolated to the component and the applied coating.
A method comprising:
- configuring a component in communication with a substrate in a first position;
- applying a coating to the component, the coating comprising a material in a first phase having a transition temperature, wherein the transition temperature of the material is about 270 degrees Celsius;
- subjecting the coating to a thermal event meeting or exceeding the transition temperature wherein:
- the thermal event includes increasing the temperature of a part to a second temperature above a solder reflow temperature and below a critical temperature of the substrate, the part selected from the group consisting of:
- the substrate and the component;
- responsive to the thermal event, subjecting the material to a phase change from the first phase to a second phase;
- and
- the phase change altering the positon of the component from the first position to a second position, including the second position being a separation of the component from the substrate.
Dependencies are inferred from the claim text.