Molded circuit board
AssigneeFurukawa Electric Co., Ltd.
InventorsKenzo Kobayashi, Hirokazu Shiroishi
Life of this patent
Estimating the term…
Abstract
A molded circuit board formed by molding a resin substrate to one side of a circuit film made by forming a desired circuit pattern to an insulating film in a manner to form an integral body. In the circuit film, there are provided soldering pad regions for mounting surface-mounting parts in a surface of the circuit film opposite the other surface in contact with resin substrate and through-holes at locations of the circuit film where insert-mounting parts are mounted. In the resin substrate, holes for receiving insert-mounting parts are formed in the molding process at the locations corresponding to the through-holes of the circuit film.
Claims8
A molded circuit board comprising:
- a circuit film having an insulating film and a desired circuit pattern on said insulating film;
- and
- a resin substrate integrally molded on one surface of said circuit film,
- said circuit film having bonding pad regions, formed in a surface thereof opposite the surface in contact with resin substrate, for mounting surface mounting type parts, and through-holes formed at locations thereof where insert-mounting parts are to be mounted,
- said resin substrate having holes, formed at locations thereof corresponding to said through-holes, for receiving the leads of insert-mounting type parts,
Dependencies are inferred from the claim text.