H05K 1/185
Associated with components encapsulated in the insulating substrate of the pcbs
Official title: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
H05K1/185 (Associated with components encapsulated in the insulating substrate of the pcbs) appears on 2,927 US grants and 3,671 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,927
- Published applications
- 3,671
- Assignees
- 721
- Inventors
- 4,948
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 4 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 6 | 0 |
| 1999 | 8 | 0 |
| 2000 | 7 | 0 |
| 2001 | 8 | 7 |
| 2002 | 22 | 44 |
| 2003 | 29 | 45 |
| 2004 | 32 | 78 |
| 2005 | 43 | 86 |
| 2006 | 57 | 90 |
| 2007 | 67 | 117 |
| 2008 | 52 | 167 |
| 2009 | 63 | 141 |
| 2010 | 106 | 146 |
| 2011 | 118 | 135 |
| 2012 | 117 | 135 |
| 2013 | 118 | 137 |
| 2014 | 131 | 242 |
| 2015 | 160 | 232 |
| 2016 | 168 | 204 |
| 2017 | 194 | 172 |
| 2018 | 203 | 192 |
| 2019 | 205 | 171 |
| 2020 | 173 | 201 |
| 2021 | 165 | 169 |
| 2022 | 152 | 180 |
| 2023 | 153 | 167 |
| 2024 | 139 | 152 |
| 2025 | 134 | 140 |
| 2026 | 68 | 121 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Embedded package structure and power supply apparatus29 Sep 2026US 12,750,955 B2Huawei Digital Power Technologies Co., Ltd.
- Circuit board and semiconductor package having the same25 Aug 2026US 12,721,201 B2LG Innotek Co., Ltd.
- Camera module packaging structure and electronic device having the same18 Aug 2026US 12,713,521 B2Triple Win Technology(Shenzhen) Co. Ltd.
- Ceramic-based circuit board assemblies formed using metal nanoparticles18 Aug 2026US 12,713,527 B2Kuprion Inc.
- Circuit board and manufacturing method18 Aug 2026US 12,713,535 B2NHK Spring Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0312273 A1Amkor Technology Singapore Holding Pte.Ltd.
- Circuit board and semiconductor package comprising same1 Oct 2026US 2026/0304606 A1LG Innotek Co., Ltd.
- Component Carrier With Electronic Component and Thick Thermally Conductive Layers on Both Sides1 Oct 2026US 2026/0304632 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Dummy Body Embedded in a Component Carrier1 Oct 2026US 2026/0304633 A1AT&S (Chongqing) Company Limited
- Wiring board1 Oct 2026US 2026/0304634 A1Shinko Electric Industries Co., Ltd.
Most cited
By later US patents
- Hermetically sealed printed circuit boards511US 10,588,231 B2Covidien LP · 2020
- Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system387US 7,619,901 B2EPIC Technologies, Inc. · 2009
- Three-dimensional multichip module systems334US 5,111,278 A1992
- Process for making active interposer for high performance packaging applications302US 6,461,895 B1Intel Corporation · 2002
- Component built-in module and method for producing the same277US 6,734,542 B2Matsushita Electric Industrial Co., Ltd. · 2004