H05K 1/186
Manufactured by mounting on or connecting to patterned circuits before or during
Official title: {manufactured by mounting on or connecting to patterned circuits before or during embedding}
H05K1/186 (Manufactured by mounting on or connecting to patterned circuits before or during) appears on 872 US grants and 1,042 published applications in this corpus.
Search patents in H05K- Granted patents
- 872
- Published applications
- 1,042
- Assignees
- 314
- Inventors
- 1,822
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 5 | 0 |
| 2001 | 2 | 5 |
| 2002 | 12 | 9 |
| 2003 | 8 | 20 |
| 2004 | 8 | 31 |
| 2005 | 20 | 34 |
| 2006 | 25 | 25 |
| 2007 | 27 | 41 |
| 2008 | 21 | 51 |
| 2009 | 17 | 44 |
| 2010 | 34 | 48 |
| 2011 | 38 | 32 |
| 2012 | 31 | 39 |
| 2013 | 31 | 39 |
| 2014 | 36 | 67 |
| 2015 | 37 | 65 |
| 2016 | 50 | 62 |
| 2017 | 72 | 49 |
| 2018 | 59 | 42 |
| 2019 | 53 | 46 |
| 2020 | 47 | 51 |
| 2021 | 38 | 44 |
| 2022 | 40 | 42 |
| 2023 | 45 | 55 |
| 2024 | 38 | 47 |
| 2025 | 43 | 21 |
| 2026 | 19 | 33 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Embedded package structure and power supply apparatus29 Sep 2026US 12,750,955 B2Huawei Digital Power Technologies Co., Ltd.
- Circuit board and manufacturing method18 Aug 2026US 12,713,535 B2NHK Spring Co., Ltd.
- Flexible printed circuit, ink and method for obtaining flexible printed circuit thereof11 Aug 2026US 12,707,565 B2Universidade De Coimbra
- Power module28 Jul 2026US 12,695,023 B2Delta Electronics, Inc.
- Hybrid bonded passive integrated devices on glass core30 Jun 2026US 12,672,239 B2Intel Corporation
- Semiconductor assembly including a semiconductor package with a delamination mitigation feature1 Oct 2026US 2026/0305457 A1Infineon Technologies Austria AG
- Device for forming resin laminate, circuit board, and method for forming circuit board20 Aug 2026US 2026/0247538 A1Fuji Corporation
- Component Carrier and Method of Manufacturing the Same13 Aug 2026US 2026/0239538 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Circuit board assembly with embedded electronic devices and method for manufacturing the same6 Aug 2026US 2026/0231338 A1Avary Holding (Shenzhen) Co., Limited.
- Chip-embedded printed circuit board structure and method for manufacturing same30 Jul 2026US 2026/0223293 A1Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
Most cited
By later US patents
- Component built-in module and method for producing the same277US 6,734,542 B2Matsushita Electric Industrial Co., Ltd. · 2004
- Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers163US 5,703,400 AGeneral Electric Company · 1997
- Circuit component built-in module and method for producing the same156US 6,038,133 AMatsushita Electric Industrial Co., Ltd. · 2000
- Printed wiring board and method of producing the same149US 6,724,638 B1Ibiden Co., Ltd. · 2004
- Process for fabricating a leadless plastic chip carrier128US 6,946,324 B1ASAT Ltd. · 2005