Printed wiring board and method of producing the same
AssigneeIbiden Co., Ltd.
InventorsYasushi Inagaki, Motoo Asai, Dongdong Wang, Hideo Yabashi, Seiji Shirai
Life of this patent
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Abstract
A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makesit possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 is constituted by providing a first resin substrate 30a, a second resin substrate 30b and a third resin substrate 30c in a multilayer manner, the core substrate 30 can obtain sufficient strength.
Claims10
A printed circuit board constituted by alternately laminating interlayer resin insulating layers and conductive circuits on a core substrate containing a capacitor, an IC chip being mounted on an outer layer thereof wherein
- the core substrate containing said capacitor is constituted by providing a first resin substrate, a second resin substrate having an opening for containing the capacitor and a third resin substrate in a multilayer manner while interposing bonding plates,
- the capacitor is located immediately below the IC chip, and
- said first resin substrate and said capacitor are coupled to each other by an insulating bonding agent and the insulating bonding agent is lower in a coefficient of thermal expansion than said first resin substrate.
Dependencies are inferred from the claim text.