Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers
AssigneeGeneral Electric Company
InventorsRobert John Wojnarowski, Thomas Bert Gorczyca
Life of this patent
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Abstract
First and second flexible interconnect structures are provided and each includes a flexible interconnect layer and a chip with a surface having chip pads attached to the flexible interconnect layer. Molding material is inserted between the flexible interconnect layers for encapsulating the respective chips. Vias in the flexible interconnect layers are formed to extend to selected chip pads, and a pattern of electrical conductors is applied which extends over the flexible interconnect layers and into the vias to couple selected ones of the chip pads.
Claims9
A two-sided molded circuit module with flexible interconnect layers, the module comprising:
- first and second flexible interconnect structures, each flexible interconnect structure comprising a flexible interconnect layer having a chip surface and at least one chip with chip pads attached to the chip surface, the chip surface of the first flexible interconnect structure facing the chip surface of the second interconnect structure;
- molding material between the chip surfaces of the flexible interconnect layers encapsulating each of the at least one chips;
- vias in the flexible interconnect layers, at least some of the vias extending to selected chip pads;
- a pattern of electrical conductors extending over the flexible interconnect layers and into the vias to couple selected ones of the chip pads.
A stack of two-sided molded circuit modules with flexible interconnect layers, the stack comprising:
- a plurality of circuit modules, each circuit module comprising first and second flexible interconnect structures, each flexible interconnect structure comprising a flexible interconnect layer having a chip surface and at least one chip with chip pads attached to the chip surface, the chip surface of the first flexible interconnect structure facing the chip surface of the second interconnect structure, molding material between the chip surfaces of the flexible interconnect layers encapsulating each of the at least one chips, vias in at least one of the flexible interconnect layers, at least one of the vias extending to a chip pad, and a pattern of electrical conductors extending over the at least one of the flexible interconnect layers and into the vias;
- and
- bonding material between adjacent ones of the circuit modules.
Dependencies are inferred from the claim text.