Chip-embedded printed circuit board structure and method for manufacturing same

A chip-embedded printed circuit board structure, wherein the chip-embedded printed circuit board structure comprises:

• a conductive substrate, wherein the conductive substrate comprises a first surface and a second surface opposite to the first surface;
• a conductive metal layer and a chip bonded to a same surface of the conductive substrate, wherein upper surfaces of the conductive metal layer and the chip are flush with each other;
• an insulating material layer, wherein the insulating material layer is disposed at least on the first surface of the conductive substrate where the conductive metal layer and the chip are located, and encapsulating the conductive metal layer and the chip;
• a redistribution layer, wherein the redistribution layer is disposed at least on one surface of the insulating material layer that encapsulates the conductive metal layer and the chip;
• and
• plated through holes, wherein the plated through holes comprises through holes and a metal filler layer filling the through holes, extending inward from a surface of the redistribution layer to connect to the conductive metal layer and the chip, respectively, so as to electrically connect the redistribution layer to the conductive metal layer and the chip.