Hybrid bonded passive integrated devices on glass core
AssigneeIntel Corporation
InventorsKristof Darmawikarta, Srinivas Venkata Ramanuja Pietambaram, Gang Duan, Sameer Paital
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Abstract
An electronic device includes a substrate including a glass core layer and first contact pads on a first surface of the glass core layer; one or more discrete passive electronic components disposed on the first surface of the glass core layer, the one or more discrete passive electronic components including second contact pads on a bottom surface of the one or more discrete passive electronic components; and hybrid bonds between the first contact pads of the glass core layer and the second contact pads of the one or more discrete passive electronic components.
Claims16
An electronic device comprising:
- a glass core layer;
- through glass vias (TGVs) extending through only the glass core layer;
- first contact pads on a first surface of the glass core layer and in direct contact with corresponding ones of the TGVs;
- one or more discrete passive electronic components over the first surface of the glass core layer, each of the one or more discrete passive electronic components including second contact pads on a bottom surface of the one or more discrete passive electronic components;
- hybrid bonds comprising first bonds between the first contact pads of the glass core layer and the second contact pads of the one or more discrete passive electronic components;
- and
- a third dielectric material over the first surface of the glass core layer, and over one or more of the TGVs that are adjacent to the discrete passive electronic components.
A method of making an electronic device, the method comprising:
- forming a first dielectric layer in direct contact with a first surface of a glass core layer;
- forming contact pads on the first surface of the glass core layer, adjacent to the first dielectric layer, and in direct contact with through glass vias (TGVs) that extend through only the glass core layer;
- disposing one or more discrete passive electronic components on the dielectric layer;
- forming hybrid bonds comprising first bonds between the contact pads on the first surface of the glass core layer and contact pads on a first surface of the one or more discrete passive electronic components and second bonds between a second dielectric layer of the one or more discrete passive electronic components and the first dielectric layer;
- and
- depositing a third dielectric layer over the first surface of the glass core layer, and over one or more of the TGVs that are adjacent to the discrete passive electronic components.
Dependencies are inferred from the claim text.