H05K 1/182
Associated with components mounted in printed circuit boards [pcb]
Official title: associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
H05K1/182 (Associated with components mounted in printed circuit boards [pcb]) appears on 5,413 US grants and 6,264 published applications in this corpus.
Search patents in H05K- Granted patents
- 5,413
- Published applications
- 6,264
- Assignees
- 1,547
- Inventors
- 9,997
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 5 | 0 |
| 1978 | 4 | 0 |
| 1979 | 6 | 0 |
| 1980 | 6 | 0 |
| 1981 | 6 | 0 |
| 1982 | 7 | 0 |
| 1983 | 5 | 0 |
| 1984 | 11 | 0 |
| 1985 | 8 | 0 |
| 1986 | 12 | 0 |
| 1987 | 10 | 0 |
| 1988 | 16 | 0 |
| 1989 | 17 | 0 |
| 1990 | 18 | 0 |
| 1991 | 26 | 0 |
| 1992 | 22 | 0 |
| 1993 | 13 | 0 |
| 1994 | 19 | 0 |
| 1995 | 21 | 0 |
| 1996 | 19 | 0 |
| 1997 | 34 | 0 |
| 1998 | 45 | 0 |
| 1999 | 34 | 0 |
| 2000 | 55 | 0 |
| 2001 | 56 | 25 |
| 2002 | 69 | 98 |
| 2003 | 73 | 89 |
| 2004 | 84 | 156 |
| 2005 | 92 | 176 |
| 2006 | 98 | 200 |
| 2007 | 127 | 224 |
| 2008 | 114 | 283 |
| 2009 | 122 | 263 |
| 2010 | 185 | 253 |
| 2011 | 211 | 211 |
| 2012 | 199 | 201 |
| 2013 | 179 | 233 |
| 2014 | 210 | 328 |
| 2015 | 226 | 353 |
| 2016 | 271 | 323 |
| 2017 | 313 | 314 |
| 2018 | 313 | 317 |
| 2019 | 343 | 311 |
| 2020 | 315 | 347 |
| 2021 | 269 | 261 |
| 2022 | 255 | 291 |
| 2023 | 239 | 284 |
| 2024 | 226 | 299 |
| 2025 | 264 | 242 |
| 2026 | 138 | 182 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Electronic device29 Sep 2026US 12,750,946 B2Kmw Inc.
- Embedded package structure and power supply apparatus29 Sep 2026US 12,750,955 B2Huawei Digital Power Technologies Co., Ltd.
- Systems and methods for an interlocking feature on a power module22 Sep 2026US 12,745,368 B2BorgWarner US Technologies LLC
- Systems and methods for active discharge for inverter for electric vehicle22 Sep 2026US 12,745,369 B2BorgWarner US Technologies LLC
- Structural enclosure for protection against foreign object debris and restraint of thermal interface material15 Sep 2026US 12,739,978 B2Raytheon Company
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0312273 A1Amkor Technology Singapore Holding Pte.Ltd.
- Optical sensor modules with interferometric sensing1 Oct 2026US 2026/0298615 A1Apple Inc.
- Circuit board and semiconductor package comprising same1 Oct 2026US 2026/0304606 A1LG Innotek Co., Ltd.
- Component Carrier With Electronic Component and Thick Thermally Conductive Layers on Both Sides1 Oct 2026US 2026/0304632 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Dummy Body Embedded in a Component Carrier1 Oct 2026US 2026/0304633 A1AT&S (Chongqing) Company Limited
Most cited
By later US patents
- Ceramic emitter substrate831US 8,355,766 B2Masimo Corporation · 2013
- Hermetically sealed printed circuit boards511US 10,588,231 B2Covidien LP · 2020
- Vehicle lamp411US 5,038,255 AFurukawa Electric Co., Ltd. · 1991
- Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system387US 7,619,901 B2EPIC Technologies, Inc. · 2009
- L.E.D. thermal management341US 6,428,189 B1Relume Corporation · 2002