H05K 1/183
Associated with components mounted in and supported by recessed areas of the
Official title: associated with components mounted in and supported by recessed areas of the PCBs
H05K1/183 (Associated with components mounted in and supported by recessed areas of the) appears on 1,223 US grants and 1,421 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,223
- Published applications
- 1,421
- Assignees
- 524
- Inventors
- 2,875
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 1 | 0 |
| 1986 | 4 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 5 | 0 |
| 1991 | 8 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 8 | 0 |
| 1995 | 5 | 0 |
| 1996 | 4 | 0 |
| 1997 | 10 | 0 |
| 1998 | 11 | 0 |
| 1999 | 10 | 0 |
| 2000 | 13 | 0 |
| 2001 | 17 | 11 |
| 2002 | 22 | 17 |
| 2003 | 15 | 16 |
| 2004 | 21 | 39 |
| 2005 | 21 | 42 |
| 2006 | 18 | 47 |
| 2007 | 28 | 50 |
| 2008 | 28 | 66 |
| 2009 | 29 | 62 |
| 2010 | 37 | 49 |
| 2011 | 53 | 41 |
| 2012 | 36 | 31 |
| 2013 | 32 | 49 |
| 2014 | 39 | 75 |
| 2015 | 52 | 79 |
| 2016 | 53 | 67 |
| 2017 | 83 | 77 |
| 2018 | 66 | 80 |
| 2019 | 78 | 63 |
| 2020 | 66 | 71 |
| 2021 | 54 | 60 |
| 2022 | 59 | 82 |
| 2023 | 59 | 77 |
| 2024 | 54 | 63 |
| 2025 | 67 | 59 |
| 2026 | 34 | 48 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed circuit board1 Sep 2026US 12,727,088 B2Samsung Electro-Mechanics Co., Ltd.
- Efficient assembly for electrolytic capacitors on solid state drives25 Aug 2026US 12,720,682 B2SanDisk Technologies LLC
- Ceramic-based circuit board assemblies formed using metal nanoparticles18 Aug 2026US 12,713,527 B2Kuprion Inc.
- Circuit board and manufacturing method18 Aug 2026US 12,713,535 B2NHK Spring Co., Ltd.
- Circuit board11 Aug 2026US 12,707,571 B2LG Innotek Co., Ltd.
- Optical sensor modules with interferometric sensing1 Oct 2026US 2026/0298615 A1Apple Inc.
- Wiring board, electronic device, and electronic module17 Sep 2026US 2026/0282236 A1KYOCERA Corporation
- Method for manufacturing electronic component built-in substrate and electronic component built-in substrate17 Sep 2026US 2026/0282240 A1Ibiden Co., Ltd.
- Easy to remove standoff20 Aug 2026US 2026/0247537 A1Quanta Computer Inc.
- Device for forming resin laminate, circuit board, and method for forming circuit board20 Aug 2026US 2026/0247538 A1Fuji Corporation
Most cited
By later US patents
- Ceramic emitter substrate831US 8,355,766 B2Masimo Corporation · 2013
- Vehicle lamp411US 5,038,255 AFurukawa Electric Co., Ltd. · 1991
- Electronic apparatus and a method for manufacturing the same248US 5,038,251 ACasio Computer Co., Ltd. · 1991
- Multi-feature-size electronic structures227US 6,606,247 B2Alien Technology Corporation · 2003
- Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module207US 5,598,032 AGemplus Card International · 1997