Method for manufacturing electronic component built-in substrate and electronic component built-in substrate
AssigneeIbiden Co., Ltd.
InventorKazuki KAJIHARA
Life of this patent
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Abstract
An electronic component built-in substrate includes a core substrate having a cavity, an electronic component assembly accommodated in the cavity and including electronic components, and a resin filler filling the cavity of the core substrate such that the resin filler is covering the core substrate and the electronic component assembly. The electronic component assembly includes a mold resin covering the entirety of the electronic components and having a sloped surface such that the sloped surface of the mold resin is inclined from the top of the electronic component assembly to the bottom of the electronic component assembly.
Claims20
A method for manufacturing an electronic component built-in substrate, comprising:
- preparing a core substrate;
- forming a cavity in the core substrate such that the cavity is configured to accommodate an electronic component assembly;
- placing an adhesive tape on a surface of the core substrate such that the adhesive tape covers the cavity formed in the core substrate;
- temporarily fixing the electronic component assembly on a portion of the adhesive tape exposed in the cavity formed in the core substrate;
- filling the cavity in which the electronic component assembly is temporarily fixed with a resin filler such that the resin filler covers the electronic component assembly;
- curing the resin filler filling the cavity in which the electronic component assembly is temporarily fixed;
- and
- removing the adhesive tape from the surface of the core substrate such that an electronic component built-in substrate having the electronic component assembly incorporated inside the cavity of the core substrate via the resin filler is formed,
- wherein the electronic component assembly comprises a plurality of electronic components and a mold resin covering an entirety of the electronic components and having a sloped surface such that the sloped surface of the mold resin is inclined from a top of the electronic component assembly to a bottom of the electronic component assembly.
An electronic component built-in substrate, comprising:
- a core substrate having a cavity;
- an electronic component assembly accommodated in the cavity and comprising a plurality of electronic components;
- and
- a resin filler filling the cavity of the core substrate such that the resin filler is covering the core substrate and the electronic component assembly,
- wherein the electronic component assembly comprises a mold resin covering an entirety of the electronic components and having a sloped surface such that the sloped surface of the mold resin is inclined from a top of the electronic component assembly to a bottom of the electronic component assembly.
Dependencies are inferred from the claim text.