H05K 1/184
Associated with components inserted in holes through the pcbs and wherein terminals
Official title: associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
H05K1/184 (Associated with components inserted in holes through the pcbs and wherein terminals) appears on 596 US grants and 643 published applications in this corpus.
Search patents in H05K- Granted patents
- 596
- Published applications
- 643
- Assignees
- 357
- Inventors
- 1,392
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 5 | 0 |
| 1985 | 5 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 6 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 0 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 4 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 5 | 0 |
| 2002 | 0 | 8 |
| 2003 | 4 | 5 |
| 2004 | 4 | 5 |
| 2005 | 5 | 11 |
| 2006 | 5 | 14 |
| 2007 | 5 | 8 |
| 2008 | 4 | 12 |
| 2009 | 6 | 12 |
| 2010 | 8 | 8 |
| 2011 | 10 | 15 |
| 2012 | 9 | 15 |
| 2013 | 7 | 25 |
| 2014 | 24 | 22 |
| 2015 | 18 | 41 |
| 2016 | 39 | 43 |
| 2017 | 41 | 47 |
| 2018 | 38 | 40 |
| 2019 | 43 | 54 |
| 2020 | 62 | 65 |
| 2021 | 41 | 40 |
| 2022 | 41 | 36 |
| 2023 | 32 | 36 |
| 2024 | 31 | 38 |
| 2025 | 39 | 23 |
| 2026 | 16 | 20 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Electronic device including a substrate with an electronic component and a heat emitting body disposed on respective surfaces of the substrate25 Aug 2026US 12,720,666 B2LG Innotek Co., Ltd.
- Reworking solder component without part removal28 Jul 2026US 12,696,399 B2International Business Machines Corporation
- High-current element for high-current printed circuit boards21 Jul 2026US 12,690,124 B2ZF Friedrichshafen AG
- Interconnect device and module using same7 Jul 2026US 12,676,434 B2Zomedica Biotechnologies LLC
- Printed circuit board with embedded smd device24 Sep 2026US 2026/0292994 A1Littelfuse Semiconductor (Wuxi) Co., Ltd.
- Electronic device comprising connector13 Aug 2026US 2026/0237927 A1Samsung Electronics Co., Ltd.
- Semiconductor storage device, and semiconductor storage device manufacturing method30 Jul 2026US 2026/0223292 A1Kioxia Corporation
- Power module23 Jul 2026US 2026/0214806 A1Mitsubishi Electric Corporation
- Electronic device comprising connector2 Jul 2026US 2026/0190261 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- High speed discrete wire pin panel assembly with embedded capacitors130US 4,878,155 A1989
- Apparatus and method for flat circuit assembly128US 5,600,175 ATexas Instruments Incorporated · 1997
- Apparatus and method for flat circuit assembly107US 5,729,053 ATexas Instruments Incorporated · 1998
- Electrical devices70US 5,852,397 ARaychem Corporation · 1998
- Stackable via package and method64US 8,222,538 B1Amkor Technology, Inc. · 2012