Stackable via package and method
AssigneeAmkor Technology, Inc.
InventorsAkito Yoshida, Mahmoud Dreiza, Curtis Michael Zwenger
Life of this patent
Estimating the term…
Abstract
A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A<B and 0=<C<½×D. The shape of the via aperture prevents solder deformation of the solder column formed from the solder ball as well as prevents solder bridging between adjacent solder columns.
Claims20
A stackable via package comprising:
- a substrate comprising a first surface;
- a trace on the first surface, the trace comprising a terminal;
- a solder ball on the terminal, the solder ball having a solder ball diameter A and a solder ball height D;
- a package body comprising a solder ball contact surface in direct physical contact with a first portion of the solder ball enclosed by the package body;
- and
- a via aperture in the package body exposing a second portion of the solder ball, the via aperture comprising a via bottom having a via bottom diameter B and a via bottom height C from the first surface of the substrate, where A<B and 0=<C<½×D.
A stackable via package comprising:
- a substrate comprising a first surface;
- a trace on the first surface, the trace comprising a terminal;
- a solder ball on the terminal, the solder ball having a solder ball diameter A and a solder ball height D;
- a package body;
- and
- a via aperture in the package body exposing the solder ball, the via aperture comprising a via bottom having a via bottom diameter B and a via bottom height C from the first surface of the substrate, where A<B and 0=<C<½×D, wherein the via aperture is defined by a via aperture sidewall of the package body, the via aperture sidewall extending between a principal surface of the package body and the first surface of the substrate.
A stackable via package comprising:
- a substrate comprising a first surface;
- a trace on the first surface, the trace comprising a terminal;
- a solder ball on the trace, the solder ball having a solder ball diameter A;
- a package body comprising a solder ball contact surface in direct physical contact with a first portion of the solder ball enclosed by the package body;
- and
- a via aperture in the package body exposing a second portion of the solder ball, the via aperture being defined by a via aperture sidewall of the package body and a via aperture shelf of the package body, the via aperture shelf having a via aperture shelf diameter B, the second portion of the solder ball exposed from the via aperture shelf having an exposed solder ball diameter E, where A>B>E.
A method of forming a stackable via package comprising:
- mounting an electronic component to a first surface of a substrate;
- forming a solder ball on a terminal of a trace on the first surface of the substrate, wherein the solder ball has a solder ball diameter A and a solder ball height D;
- enclosing the electronic component and the solder ball in a package body;
- and
- forming a via aperture in the package body such that a solder ball contact surface of the package body remains in direct physical contact with a first portion of the solder ball enclosed by the package body while a second portion of the solder ball is exposed through the via aperture, the via aperture comprising a via bottom having a via bottom diameter B and a via bottom height C from the first surface of the substrate, where A<B and 0=<C<½×D.
Dependencies are inferred from the claim text.