High speed discrete wire pin panel assembly with embedded capacitors

In a high speed logic panel which includes a board member of insulative material with opposite faces and voltage and ground conductive layers each lying on one of said faces and with said layers lying in parallel planes, the improvement wherein:

• said board member has a plurality of capacitor-receiving through holes and said conductive layers have holes aligned with said board member holes, each of said conductive layer holes having first and second opposite sides;
• a plurality of capacitors that each have a body with an insulative middle and opposite ends and with electrically conductive layers over its ends forming capacitor terminals, each capacitor lying in one of said board holes with its terminals lying adjacent respectively to said voltage and ground conductive layers;
• a quantity of solder extending between each capacitor terminal and an adjacent conductive layer;
• each quantity of solder extending from a capacitor terminal to only one side of the hole in the corresponding conductive layer, to leave the opposite side of the hole in the same conductive layer free of blockage by that quantity of solder, whereby to allow the flow of washout fluid completely through each of said capacitor-receiving holes after installation of a capacitor in the capacitor-receiving hole.

A high speed logic panel comprising:

• a board member of insulative material having first and second opposite faces;
• first and second conductive layers lying respectively over said first and second faces;
• a plurality of pairs of rows of lead-receiving socket pins mounted in said board, the pins spaced apart by a first distance along each row and the rows of each pair being spaced apart by a second distance which is a plurality of times as great as said first distance to leave a board space between the rows;
• a plurality of dual-in-line integrated circuits, each lying over one of said board spaces and having a pair of rows of terminals received in pins of said pairs of rows of pins;
• plurality of holes in said circuit board, each lying in one of said board spaces that lies between a pair of rows of contacts;
• a plurality of capacitors, each capacitor having a pair of opposite ends and a length as measured between its ends, each capacitor having a leadless conductive terminal at each end and a capacitance between said terminals;
• each capacitor lying in one of said holes under one of said integrated circuits, with the opposite ends of the capacitor and the terminals thereat each lying adjacent to a different one of said conductive layers, and a quantity of solder extending directly between each of said terminals and an adjacent conductive layer and electrically and mechanically connecting the terminals to the conductive layers.

A high speed discrete wire logic pin panel comprising:

• a circuit board which includes a board of insulative material with opposite faces, and voltage and ground conductive layers each lying on a different one of said board faces, said circuit board having a pin grid array section forming a grid of multiple rows and columns of through holes, with the holes being uniformly spaced along each row and along each column;
• a multiplicity of lead-receiving pins, each lying in one of said holes;
• said grid array section including at least 12 columns of uniformly spaced holes and at least 12 rows of uniformly spaced holes, with at least 95% of all of said holes containing one of said pins;
• a plurality of integrated circuits, each lying over said grid array section and having a plurality of rows of leads lying in a corresponding plurality of rows of pins, each integrated circuit having a pin-free area devoid of leads and lying over a plurality of said holes;
• at least one of said holes lying under said pin-free area being devoid of a pin, but holding a capacitor with terminals lying respectively adjacent to said voltage and ground planes and connected thereto.