Process for fabricating a leadless plastic chip carrier
AssigneeASAT Ltd.
InventorsNeil McLellan, Chun Ho Fan, Kin Pui Kwan, Wing Him Lau
Life of this patent
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Abstract
A process for fabricating a leadless plastic chip carrier includes laminating a first metal strip to a second metal strip to form a leadframe strip, selectively etching the first metal strip to define at least a row of contact pads, mounting a semiconductor die to either a die attach pad or the second metal strip and wire bonding the semiconductor die to ones of the contact pads, encapsulating a top surface of the leadframe strip in a molding material, removing the second metal strip, thereby exposing the die attach pad and the at least one row of contact pads, and singulating the leadless plastic chip carrier from the leadframe strip.
Claims10
A process for fabricating a leadless plastic chip carrier, comprising:
- laminating a first metal strip to a second metal strip to form a leadframe strip;
- selectively etching said first metal strip to define at least a die attach pad and at least one row of contact pads;
- mounting a semiconductor die to said die attach pad and wire bonding said semiconductor die to ones of said contact pads;
- encapsulating a top surface of said leadframe strip in a molding material;
- removing said second metal strip, thereby exposing said die attach pad and said at least one row of contact pads;
- and
- singulating the leadless plastic chip carrier from the leadframe strip.
Dependencies are inferred from the claim text.