H05K 1/188
Manufactured by mounting on or attaching to a structure having a conductive
Official title: {manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component}
H05K1/188 (Manufactured by mounting on or attaching to a structure having a conductive) appears on 240 US grants and 290 published applications in this corpus.
Search patents in H05K- Granted patents
- 240
- Published applications
- 290
- Assignees
- 109
- Inventors
- 464
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 4 |
| 2003 | 3 | 3 |
| 2004 | 2 | 3 |
| 2005 | 1 | 7 |
| 2006 | 5 | 8 |
| 2007 | 6 | 8 |
| 2008 | 3 | 11 |
| 2009 | 2 | 10 |
| 2010 | 7 | 24 |
| 2011 | 11 | 11 |
| 2012 | 10 | 9 |
| 2013 | 9 | 5 |
| 2014 | 13 | 19 |
| 2015 | 3 | 22 |
| 2016 | 18 | 14 |
| 2017 | 21 | 13 |
| 2018 | 14 | 9 |
| 2019 | 13 | 14 |
| 2020 | 14 | 18 |
| 2021 | 14 | 21 |
| 2022 | 22 | 22 |
| 2023 | 16 | 17 |
| 2024 | 15 | 11 |
| 2025 | 8 | 4 |
| 2026 | 8 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and manufacturing method18 Aug 2026US 12,713,535 B2NHK Spring Co., Ltd.
- Electronic package module and method for fabrication of the same9 Jun 2026US 12,652,760 B2USI Science and Technology (Shenzhen) Co., Ltd.
- Printed wiring board2 Jun 2026US 12,648,080 B2Ibiden Co., Ltd.
- Circuit board with embedded elements and method for fabricating the same26 May 2026US 12,641,730 B2Boardtek Electronics Corporation
- Electronic component14 Apr 2026US 12,604,410 B2TDK Corporation
- Hybrid circuit board23 Jul 2026US 2026/0214793 A1Tong Hsing Electronic Industries, Ltd.
- Semiconductor module packaging structure9 Jul 2026US 2026/0197944 A1Industrial Technology Research Institute
- Wiring substrate12 Feb 2026US 2026/0047010 A1Shinko Electric Industries Co., Ltd.
- Circuit board with embedded elements and method for fabricating the same20 Nov 2025US 2025/0358936 A1Boardtek Electronics Corporation
- Display device, manufacturing method thereof, and electronic device including the same18 Sep 2025US 2025/0294694 A1Samsung Display Co., Ltd.
Most cited
By later US patents
- Component built-in module and method for producing the same277US 6,734,542 B2Matsushita Electric Industrial Co., Ltd. · 2004
- Circuit component built-in module and method for producing the same156US 6,038,133 AMatsushita Electric Industrial Co., Ltd. · 2000
- Method of manufacturing the circuit device and circuit device71US 6,562,660 B1Sanyo Electric Co., Ltd. · 2003
- Circuit device and manufacturing method of circuit device65US 6,548,328 B1Sanyo Electric Co., Ltd. · 2003
- Circuit board with built-in electronic component and method for manufacturing the same54US 7,091,593 B2Matsushita Electric Industrial Co., Ltd. · 2006