H05K 1/188

Manufactured by mounting on or attaching to a structure having a conductive

Official title: {manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component}

H05K1/188 (Manufactured by mounting on or attaching to a structure having a conductive) appears on 240 US grants and 290 published applications in this corpus.

Search patents in H05K
Granted patents
240
Published applications
290
Assignees
109
Inventors
464
Latest grant
18 Aug 2026

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H05K 1/188: granted patents and published applications per publication year
YearGranted patentsPublished applications
200010
200100
200214
200333
200423
200517
200658
200768
2008311
2009210
2010724
20111111
2012109
201395
20141319
2015322
20161814
20172113
2018149
20191314
20201418
20211421
20222222
20231617
20241511
202584
202683

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