Semiconductor module packaging structure
AssigneeIndustrial Technology Research Institute
InventorsTsung-Yi HUNG, Shih-Hsien WU
Life of this patent
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Abstract
A semiconductor module packaging structure includes a prefabricated layer, at least one die, an insulating material layer and a customized layer. The prefabricated layer includes a plurality of multi-layer circuit boards. The multi-layer circuit boards are independent from each other and arranged side by side. The at least one die is disposed on the prefabricated layer. The insulating material layer is disposed on the prefabricated layer and covers the at least one die. The customized layer is disposed on the insulating material layer and electrically connected to the prefabricated layer.
Claims20
A semiconductor module packaging structure, comprising:
- a prefabricated layer, comprising a plurality of multi-layer circuit boards, wherein the plurality of multi-layer circuit boards are independent from each other and arranged side by side;
- at least one die, disposed on the prefabricated layer;
- an insulating material layer, disposed on the prefabricated layer and covering the at least one die;
- and
- a customized layer, disposed on the insulating material layer and electrically connected to the prefabricated layer.
A semiconductor module packaging structure, comprising:
- a prefabricated layer, comprising a plurality of multi-layer circuit boards, wherein the plurality of multi-layer circuit boards are independent from each other and arranged side by side, and each of the plurality of multi-layer circuit boards has a bottom surface and a top surface opposite to each other and comprises a plurality of outer pads located on the bottom surface and a plurality of inner pads located on the top surface.
Dependencies are inferred from the claim text.