Electronic package module and method for fabrication of the same

A method for fabricating an electronic package module, comprising:

• providing a circuit substrate, and the circuit substrate has a flat surface;
• providing an electronic component including a main part, an input end and a ground end separately located on two sides of the main part;
• and
• perpendicularly disposing the electronic component on the flat surface of the circuit substrate, and the input end is connected to the circuit substrate, wherein the ground end is disposed away from the circuit substrate along with a normal direction of the flat surface, wherein the ground end overlaps the input end in the normal direction;
• forming an encapsulation layer on the circuit substrate;
• exposing a ground surface of the ground end from the encapsulation layer;
• disposing a first insulation film on the encapsulation layer and the ground surface of the ground end;
• disposing a conductive layer on the first insulation film;
• disposing a second insulation film on the conductive layer;
• and
• exposing a part of the ground surface of the ground end by forming an opening extending through the first insulation film, the conductive layer and the second insulation film;
• and
• disposing a metal layer on the second insulation film and the opening, wherein the metal layer directly touches the ground surface of the ground end through the opening.