H01J 2237/20221
Translation
H01J2237/20221 (Translation) appears on 585 US grants and 681 published applications in this corpus.
Search patents in H01J- Granted patents
- 585
- Published applications
- 681
- Assignees
- 200
- Inventors
- 1,423
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 7 | 0 |
| 1994 | 4 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 8 | 0 |
| 1999 | 4 | 0 |
| 2000 | 9 | 0 |
| 2001 | 5 | 3 |
| 2002 | 6 | 16 |
| 2003 | 10 | 12 |
| 2004 | 13 | 19 |
| 2005 | 18 | 24 |
| 2006 | 24 | 13 |
| 2007 | 18 | 35 |
| 2008 | 21 | 27 |
| 2009 | 25 | 28 |
| 2010 | 16 | 14 |
| 2011 | 21 | 17 |
| 2012 | 17 | 18 |
| 2013 | 18 | 15 |
| 2014 | 15 | 16 |
| 2015 | 20 | 30 |
| 2016 | 15 | 19 |
| 2017 | 16 | 14 |
| 2018 | 20 | 15 |
| 2019 | 15 | 41 |
| 2020 | 43 | 48 |
| 2021 | 28 | 47 |
| 2022 | 31 | 49 |
| 2023 | 28 | 57 |
| 2024 | 33 | 37 |
| 2025 | 40 | 38 |
| 2026 | 31 | 29 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Enhanced dry desmear equipment with protective film peeling capability for integrated circuits29 Sep 2026US 12,749,660 B2Intel Corporation
- In-situ back side plasma treatment for residue removal from substrates29 Sep 2026US 12,749,661 B2Lam Research Corporation
- High selectivity, low stress, and low hydrogen carbon hardmasks in low-pressure conditions with wide gap electrode spacing15 Sep 2026US 12,735,785 B2Lam Research Corporation
- Beam position displacement correction in charged particle inspection15 Sep 2026US 12,738,445 B2ASML Netherlands B. V.
- Ion beam etching machine and lower electrode structure thereof8 Sep 2026US 12,731,758 B2Jiangsu Leuven Instruments Co. Ltd
- Shadow ring for substrate bond protection in plasma etch chamber17 Sep 2026US 2026/0279739 A1APPLIED Materials.Inc.
- System and method for adjusting an ion beam10 Sep 2026US 2026/0269182 A1APPLIED Materials.Inc.
- Line edge smoothing with jittered twist13 Aug 2026US 2026/0237589 A1Axcelis Technologies, Inc.
- Multipole magnet adjustment system and multipole magnet adjustment method13 Aug 2026US 2026/0237591 A1Kabushiki Kaisha Toshiba
- Vertically oriented implanter architecture for contactless backside substrate processing6 Aug 2026US 2026/0229445 A1
Most cited
By later US patents
- Method for inspecting substrate, substrate inspecting system and electron beam apparatus113US 7,109,483 B2Ebara Corporation · 2006
- Semiconductor device tester which measures information related to a structure of a sample in a depth direction96US 6,768,324 B1Fab Solutions, Inc. · 2004
- Ion sources, systems and methods93US 7,554,096 B2ALIS Corporation · 2009
- Parallel link mechanism, exposure system and method of manufacturing the same, and method of manufacturing devices92US 6,940,582 B1Nikon Corporation · 2005
- Stage device and pattern transfer system using the same78US 5,684,856 ACanon Kabushiki Kaisha · 1997