Parallel link mechanism, exposure system and method of manufacturing the same, and method of manufacturing devices
AssigneeNikon Corporation
InventorKeiichi Tanaka
Life of this patent
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AssigneeNikon Corporation
InventorKeiichi Tanaka
Estimating the term…
A reticle base level block to support a reticle stage for holding a reticle, a wafer base level block to support a wafer stage for holding a wafer, and the like are supported to be independent of other portions and be controllable in their attitudes by parallel link mechanisms each including at least three expandable rods. Therefore, the portions supported by the parallel link mechanism can be made lightweight using the advantages of the parallel link mechanism, and the attitudes of those can be precisely controlled with excellent operational-characteristics and high rigidity. In addition, transmission of vibrations and the like between the reticle base level block, the wafer base level block and other portions, e.g. an optical projection system, can be prevented. Therefore, a fine pattern formed on the reticle can be precisely transferred onto the wafer.
An exposure apparatus that transfers a predetermined pattern onto a substrate, the exposure apparatus comprising:
An exposure apparatus that transfers a predetermined pattern onto a substrate, the exposure apparatus comprising:
An exposure apparatus that transfers a predetermined pattern of a mask onto a substrate, the exposure apparatus comprising:
A method of making an exposure apparatus to transfer a pattern of a mask onto a substrate, comprising the steps of:
A method of making an exposure apparatus to transfer a pattern of a mask onto a substrate, comprising the steps of:
An exposure apparatus that transfers a predetermined pattern onto a substrate, the exposure apparatus comprising:
Dependencies are inferred from the claim text.