H01J 2237/20235
Z movement or adjustment
H01J2237/20235 (Z movement or adjustment) appears on 188 US grants and 261 published applications in this corpus.
Search patents in H01J- Granted patents
- 188
- Published applications
- 261
- Assignees
- 88
- Inventors
- 630
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 0 |
| 2004 | 2 | 4 |
| 2005 | 2 | 2 |
| 2006 | 2 | 2 |
| 2007 | 1 | 2 |
| 2008 | 3 | 10 |
| 2009 | 3 | 6 |
| 2010 | 5 | 5 |
| 2011 | 8 | 1 |
| 2012 | 3 | 7 |
| 2013 | 6 | 3 |
| 2014 | 6 | 5 |
| 2015 | 6 | 10 |
| 2016 | 5 | 4 |
| 2017 | 5 | 3 |
| 2018 | 4 | 7 |
| 2019 | 6 | 13 |
| 2020 | 15 | 24 |
| 2021 | 8 | 25 |
| 2022 | 12 | 29 |
| 2023 | 13 | 32 |
| 2024 | 21 | 27 |
| 2025 | 27 | 23 |
| 2026 | 20 | 16 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Enhanced dry desmear equipment with protective film peeling capability for integrated circuits29 Sep 2026US 12,749,660 B2Intel Corporation
- In-situ back side plasma treatment for residue removal from substrates29 Sep 2026US 12,749,661 B2Lam Research Corporation
- High selectivity, low stress, and low hydrogen carbon hardmasks in low-pressure conditions with wide gap electrode spacing15 Sep 2026US 12,735,785 B2Lam Research Corporation
- Ion beam etching machine and lower electrode structure thereof8 Sep 2026US 12,731,758 B2Jiangsu Leuven Instruments Co. Ltd
- Apparatus for treating substrate and method for treating substrate1 Sep 2026US 12,725,765 B2Psk Inc.
- Shadow ring for substrate bond protection in plasma etch chamber17 Sep 2026US 2026/0279739 A1APPLIED Materials.Inc.
- Charged Particle Beam Device and Method for Producing and Observing Sample Piece6 Aug 2026US 2026/0229446 A1Hitachi High-Tech Corporation
- Measurement Method and Charged Particle Beam Device23 Jul 2026US 2026/0213124 A1Hitachi High-Tech Corporation
- Wafer backside deposition cleaning23 Jul 2026US 2026/0215197 A1APPLIED Materials.Inc.
- Collation system28 May 2026US 2026/0148929 A1NEC Corporation
Most cited
By later US patents
- Electron beam exposure or system inspection or measurement apparatus and its method and height detection apparatus74US 6,107,637 AHitachi, Ltd. · 2000
- Electron beam exposure or system inspection or measurement apparatus and its method and height detection apparatus34US 7,692,144 B2Hitachi, Ltd. · 2010
- Opto-mechanical automatic focusing system and method33US 5,216,235 AAmray, Inc. · 1993
- Six-degree-of-freedom multi-axes positioning apparatus32US 5,901,936 ASandia Corporation · 1999
- Lithography apparatus using scanning tunneling microscopy26US 5,227,626 AOlympus Optical Co., Ltd. · 1993