Shadow ring for substrate bond protection in plasma etch chamber

A process chamber, comprising:

• a chamber body having an interior volume disposed therein,
• a liner disposed in the interior volume having a tubular body and a plurality of pins extending radially inward from the tubular body;
• a shadow ring disposed in the interior volume, the shadow ring having an annular body that includes an annular notch disposed along a lower surface of the annular body and a plurality of tabs extending outwardly from the annular body, wherein each of the plurality of tabs includes an alignment slot formed on a lower surface of each tab and configured to engage with a pin of the plurality of pins of the liner;
• and
• a substrate support having a substrate support surface disposed in the interior volume, wherein the substrate support is disposed below the shadow ring.