G01R 31/307
Of integrated circuits
Official title: of integrated circuits
G01R31/307 (Of integrated circuits) appears on 373 US grants and 287 published applications in this corpus.
Search patents in G01R- Granted patents
- 373
- Published applications
- 287
- Assignees
- 129
- Inventors
- 848
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 5 | 0 |
| 1996 | 9 | 0 |
| 1997 | 12 | 0 |
| 1998 | 10 | 0 |
| 1999 | 12 | 0 |
| 2000 | 8 | 0 |
| 2001 | 17 | 4 |
| 2002 | 13 | 11 |
| 2003 | 31 | 21 |
| 2004 | 15 | 15 |
| 2005 | 28 | 24 |
| 2006 | 22 | 24 |
| 2007 | 15 | 18 |
| 2008 | 22 | 18 |
| 2009 | 11 | 15 |
| 2010 | 17 | 8 |
| 2011 | 12 | 11 |
| 2012 | 8 | 7 |
| 2013 | 5 | 3 |
| 2014 | 9 | 4 |
| 2015 | 3 | 6 |
| 2016 | 7 | 8 |
| 2017 | 3 | 7 |
| 2018 | 5 | 7 |
| 2019 | 19 | 8 |
| 2020 | 10 | 8 |
| 2021 | 5 | 5 |
| 2022 | 7 | 5 |
| 2023 | 3 | 14 |
| 2024 | 6 | 10 |
| 2025 | 11 | 17 |
| 2026 | 3 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wafer level electron beam prober5 May 2026US 12,618,900 B2Intel Corporation
- Structure and method for test-point access in a semiconductor5 May 2026US 12,622,229 B2NXP USA, Inc.
- Methods and techniques for determining when a probe tip is proximate to or in contact with a sample surface28 Apr 2026US 12,613,272 B2Xallent, LLC
- Failure analysis and location method for short circuit structure23 Dec 2025US 12,506,039 B2Shanghai Huali Integrated Circuit Corporation
- Contrast-enhancing staining system and method and imaging methods and systems related thereto16 Dec 2025US 12,498,417 B2Techinsights Inc.
- Voltage contrast for backside processes on wafers1 Oct 2026US 2026/0299019 A1Intel Corporation
- Method for testing a packaging substrate, and apparatus for testing a packaging substrate17 Sep 2026US 2026/0276702 A1
- Wafer level electron beam prober13 Aug 2026US 2026/0235668 A1Intel Corporation
- Contactless electrical inspection process28 May 2026US 2026/0147034 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and method of detecting failure therein14 May 2026US 2026/0136894 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Electron beam inspection system and method257US 5,502,306 AKLA Instruments Corporation · 1996
- Feature-based defect detection256US 6,539,106 B1APPLIED Materials.Inc. · 2003
- Multi-pixel methods and apparatus for analysis of defect information from test structures on semiconductor devices229US 6,771,806 B1KLA-Tencor Corporation · 2004
- Stepper type test structures and methods for inspection of semiconductor integrated circuits184US 6,633,174 B1KLA-Tencor Corporation · 2003
- Methods and systems for predicting IC chip yield182US 6,751,519 B1KLA-Tencor Technologies Corporation · 2004