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US 2026/0235668 A1Published application
Wafer level electron beam prober
AssigneeIntel Corporation
InventorsXianghong Tong, Martin Von Haartman, Zhiyong Ma, Jennifer J. Huening, Hyuk Ju Ryu, Christopher Morgan, Shuai Zhao, Ramune Nagisetty, Tuyen K. Tran, Wen-Hsien Chuang
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Abstract
Wafer level electron beam prober systems, devices, and techniques, are described herein related to providing wafer level testing for fabricated device structures. Such wafer level testing contacts a first side of a die of a wafer with a probe to provide test signals to the die under test and performs e-beam imaging of the first side of the die while the test signals are provided to the die under test.
Claims20
A system, comprising:
- a wafer stage to receive a wafer;
- a probe to contact a first region of a first die of the wafer and to provide a corresponding test signal;
- an electron-beam (e-beam) column to provide an e-beam to a second region of the first die;
- a detector to detect an e-beam signal from the second region;
- and
- a chamber and a vacuum pump to pull a vacuum in the chamber comprising the wafer during test, wherein at least portions of the wafer stage, the probe, and the e-beam column are within the chamber, and wherein the wafer stage is to position a second die of the wafer for test while a continued vacuum is maintained during testing of the first die and the second die.
3 more elements
A method, comprising:
- pulling a vacuum in a chamber surrounding a wafer;
- positioning a first die of the wafer for test;
- and
- during said pulling the vacuum in the chamber:
- providing a first test signal to a first region of the first die;
- attaining a first electron-beam (e-beam) signal from a second region of the first die;
- positioning a second die of the wafer for test;
- providing a second test signal to a first region of the second die;
- and
- attaining a second e-beam signal from a second region of the second die.
7 more elements
A system, comprising:
- a wafer stage to receive a wafer;
- a probe to contact a first region of a first die of the wafer and to provide a corresponding test signal, wherein the probe comprises a probe card comprising a plurality of probe tips adjacent a perimeter of the probe card and a translucent or transparent region in an interior of the probe card at least partially surrounded by the perimeter;
- an electron-beam (e-beam) column to provide an e-beam to a second region of the first die;
- and
- a detector to detect an e-beam signal from the second region.
2 more elements
Dependencies are inferred from the claim text.