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US 12,618,900 B2Granted
Wafer level electron beam prober
AssigneeIntel Corporation
InventorsXianghong Tong, Martin Von Haartman, Zhiyong Ma, Jennifer J. Huening, Hyuk Ju Ryu, Christopher Morgan, Shuai Zhao, Ramune Nagisetty, Tuyen K. Tran, Wen-Hsien Chuang
Life of this patent
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Abstract
Wafer level electron beam prober systems, devices, and techniques, are described herein related to providing wafer level testing for fabricated device structures. Such wafer level testing contacts a first side of a die of a wafer with a probe to provide test signals to the die under test and performs e-beam imaging of the first side of the die while the test signals are provided to the die under test.
Claims23
A system, comprising:
- a wafer stage to receive a wafer comprising at least one die and to position the die for testing;
- a probe to contact a first region of a first side of the die and to provide a test signal to the first region of the first side of the die, wherein the probe comprises a probe card comprising a plurality of probe tips to contact pads of the first side of the die, and wherein the probe tips are adjacent a perimeter of the probe card and the probe card comprises a translucent or transparent region in an interior of the probe card at least partially surrounded by the perimeter;
- an electron-beam (e-beam) column to provide an e-beam to a second region of the first side of the die;
- a detector to detect an e-beam signal from the second region of the first side of the die;
- and
- a processor circuit to generate test data based on the e-beam signal.
3 more elements
A method, comprising:
- receiving a wafer comprising at least one die for testing;
- contacting a first region of a first side of the die, wherein contacting the first region comprises contacting the first region with a probe card, the probe card comprising a plurality of probe tips adjacent a perimeter of the probe card and a translucent or transparent region in an interior of the probe card at least partially surrounded by the perimeter;
- providing a test signal to the first region of the first side the die;
- emitting an electron-beam (e-beam) on a second region of the first side of the die;
- and
- receiving an e-beam signal from the second region of the first side of the die.
3 more elements
A method, comprising:
- pulling a vacuum in a chamber surrounding a wafer, the wafer comprising a plurality of dies for testing;
- positioning a first of the plurality of dies for testing of the first die;
- and
- during said pulling the vacuum in the chamber:
- providing a first test signal to a first region of a first side of the first die;
- attaining a first electron-beam (e-beam) signal from a second region of the first side of the first die during said providing the first test signal;
- positioning a second of the plurality of dies for testing of the second die;
- providing a second test signal to a first region of a first side of the second die;
- and
- attaining a second e-beam signal from a second region of the first side of the second die during said providing the second test signal.
7 more elements
A system, comprising:
- a wafer stage to receive a wafer comprising a first die and a second die, and to position the first die for testing;
- a probe to contact a first region of a first side of the first die and to provide a test signal to the first region of the first side of the first die;
- an electron-beam (e-beam) column to provide an e-beam to a second region of the first side of the first die;
- a detector to detect an e-beam signal from the second region of the first side of the first die;
- a chamber and a vacuum pump to pull a vacuum in the chamber comprising the first die during test, wherein at least portions of the wafer stage, the probe, and the e-beam column are within the chamber, and wherein the wafer stage is to position the second die of the wafer for testing while a continued vacuum is maintained during testing of the first die and the second die;
- and
- a processor circuit to generate test data based on the e-beam signal.
4 more elements
Dependencies are inferred from the claim text.